EP 2030732 A1 20090304 - Cleaning device for chemical-mechanical polishing equipment
Title (en)
Cleaning device for chemical-mechanical polishing equipment
Title (de)
Reinigungsvorrichtung für chemisch-mechanische Poliergeräte
Title (fr)
Dispositif de nettoyage pour équipement de polissage chimico-mécanique
Publication
Application
Priority
EP 07016861 A 20070828
Abstract (en)
Disclosed is a cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft (100) irrotatably coupled with a spindle (300) which is rotated, the irrotatable center shaft including a first channel (101) and a second channel (102) formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block (200) coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad (410), the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased.
IPC 8 full level
B24B 53/017 (2012.01)
CPC (source: EP)
B24B 53/017 (2013.01)
Citation (search report)
- [A] US 6283840 B1 20010904 - HUEY SIDNEY [US]
- [A] US 2001041517 A1 20011115 - MANFREDI PAUL A [US]
- [A] EP 1118432 A2 20010725 - APPLIED MATERIALS INC [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
DOCDB simple family (application)
EP 07016861 A 20070828