EP 2035327 A4 20120229 - MEMS DEVICE AND METHOD OF FABRICATING THE SAME
Title (en)
MEMS DEVICE AND METHOD OF FABRICATING THE SAME
Title (de)
MEMS-BAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
Dispositif MEMS et méthode de fabrication dudit dispositif
Publication
Application
Priority
- US 2007012059 W 20070521
- US 44639806 A 20060605
Abstract (en)
[origin: US2007278601A1] A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.
IPC 8 full level
B81C 1/00 (2006.01)
CPC (source: EP KR US)
B81B 7/02 (2013.01 - KR); B81C 1/00 (2013.01 - KR); B81C 1/00333 (2013.01 - EP US); H01L 29/84 (2013.01 - KR); H04R 1/04 (2013.01 - EP US); B81B 2201/0257 (2013.01 - EP US); B81B 2207/096 (2013.01 - EP US); B81C 2203/0109 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US); H04R 19/016 (2013.01 - EP US); H04R 31/006 (2013.01 - EP US)
Citation (search report)
- [XI] US 2005189622 A1 20050901 - HUMPSTON GILES [US], et al
- [XY] US 2005018864 A1 20050127 - MINERVINI ANTHONY D [US]
- [Y] US 4882212 A 19891121 - SINGHDEO NARENDRA N [US], et al
- [Y] US 6557978 B2 20030506 - SILVERBROOK KIA [AU]
- [XAI] DE 10303263 A1 20040805 - INFINEON TECHNOLOGIES AG [DE]
- [XA] US 2003133588 A1 20030717 - PEDERSEN MICHAEL [US]
- [A] JOURDAIN A ET AL: "Optimization of 0-level packaging for rf-mems devices", TRANSDUCERS, SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12TH INN ATIONAL CONFERENCE ON, 2003, PISCATAWAY, NJ, USA,IEEE, vol. 2, 9 June 2003 (2003-06-09), pages 1915 - 1918, XP010647489, ISBN: 978-0-7803-7731-8
- See references of WO 2007145778A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007278601 A1 20071206; US 7763488 B2 20100727; EP 2035327 A2 20090318; EP 2035327 A4 20120229; EP 2035327 B1 20180926; JP 2009540566 A 20091119; JP 2013208707 A 20131010; JP 5551934 B2 20140716; JP 5643880 B2 20141217; KR 101544616 B1 20150817; KR 20090033843 A 20090406; TW 200817278 A 20080416; TW I419832 B 20131221; US 2010264499 A1 20101021; US 8203190 B2 20120619; WO 2007145778 A2 20071221; WO 2007145778 A3 20080515
DOCDB simple family (application)
US 44639806 A 20060605; EP 07777193 A 20070521; JP 2009514277 A 20070521; JP 2013130599 A 20130621; KR 20087031749 A 20070521; TW 96119122 A 20070529; US 2007012059 W 20070521; US 82513110 A 20100628