Global Patent Index - EP 2035523 A1

EP 2035523 A1 20090318 - COMPOSITIONS AND METHODS FOR POLISHING SILICON NITRIDE MATERIALS

Title (en)

COMPOSITIONS AND METHODS FOR POLISHING SILICON NITRIDE MATERIALS

Title (de)

ZUSAMMENSETZUNGEN UND VERFAHREN ZUM POLIEREN VON SILICIUMNITRIDMATERIALIEN

Title (fr)

PRÉPARATIONS ET MÉTHODES DE POLISSAGE DE MATÉRIAUX EN NITRURE DE SILICIUM

Publication

EP 2035523 A1 20090318 (EN)

Application

EP 07809387 A 20070607

Priority

  • US 2007013424 W 20070607
  • US 44820506 A 20060607

Abstract (en)

[origin: WO2007146065A1] The present invention provides a method for polishing silicon nitride-containing substrates. The method comprises abrading a surface of a silicon nitride substrate with a polishing composition, which comprises colloidal silica, at least one acidic component, and an aqueous carrier. The at least one acidic component has a pKa in the range of 1 to 4.5. The composition has a pH in the range of 0.5 pH units less than the pKa of the at least one acidic component to 1.5 pH units greater than the pKa.

IPC 8 full level

C09G 1/02 (2006.01); C09K 3/14 (2006.01)

CPC (source: EP KR US)

C09G 1/02 (2013.01 - EP KR US); C09K 3/1463 (2013.01 - EP KR US); H01L 21/30625 (2013.01 - KR); H01L 21/31053 (2013.01 - EP KR US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

WO 2007146065 A1 20071221; CN 101490201 A 20090722; CN 101490201 B 20130116; EP 2035523 A1 20090318; EP 2035523 A4 20111221; EP 2035523 B1 20170913; IL 195698 A0 20090901; IL 195698 A 20140831; JP 2009540575 A 20091119; JP 5313885 B2 20131009; KR 101268128 B1 20130531; KR 20090020677 A 20090226; MY 150866 A 20140314; SG 172674 A1 20110728; TW 200804579 A 20080116; TW I374931 B 20121021; US 2007298612 A1 20071227; US 8759216 B2 20140624

DOCDB simple family (application)

US 2007013424 W 20070607; CN 200780026767 A 20070607; EP 07809387 A 20070607; IL 19569808 A 20081203; JP 2009514374 A 20070607; KR 20097000151 A 20070607; MY PI20084974 A 20070607; SG 2011040649 A 20070607; TW 96120558 A 20070607; US 44820506 A 20060607