EP 2036127 A1 20090318 - STACKABLE IC PACKAGE WITH TOP AND BOTTOM INTERCONNECT
Title (en)
STACKABLE IC PACKAGE WITH TOP AND BOTTOM INTERCONNECT
Title (de)
STAPELBARE IC-KAPSELUNG MIT OBERER UND UNTERER VERBINDUNG
Title (fr)
BOÎTIER DE CIRCUIT IMPRIMÉ EMPILABLE À INTERCONNEXION SUPÉRIEURE ET INFÉRIEURE
Publication
Application
Priority
IB 2006051946 W 20060616
Abstract (en)
[origin: WO2007148154A1] Consistent with an example embodiment, there is a stackable IC package (218) that comprises a die (206) having a first major surface and a second major surface (212). The first and second major (212) surfaces are joined by opposed pairs of longitudinal (208) and lateral sides (210). A conductive pattern (202) is electrically coupled to the first major surface of the die. The conductive pattern (202) extends past the longitudinal sides of the die and is folded back (204) in a direction (214) generally toward the die. The conductive pattern defines a first portion approximately co-planar with the first major surface of the die and a second portion approximately co-planar with the second major surface of the die. The first and second portions are electrically connectable to another stackable IC package. A support material (216) fixedly supports the conductive pattern (202) relative to the die (206) and supports the first and second portions of the conductive pattern is a spaced, generally parallel relationship to one another.
IPC 8 full level
H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP)
H01L 23/3114 (2013.01); H01L 23/4985 (2013.01); H01L 25/105 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1064 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
See references of WO 2007148154A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007148154 A1 20071227; CN 101467253 A 20090624; EP 2036127 A1 20090318; JP 2009540592 A 20091119
DOCDB simple family (application)
IB 2006051946 W 20060616; CN 200680055010 A 20060616; EP 06765775 A 20060616; JP 2009514920 A 20060616