EP 2038921 A1 20090325 - METHOD FOR ATTACHING ELECTRONIC COMPONENTS TO A SUPPORT BY MEANS OF PRESSURE SINTERING AND CIRCUIT ARRANGEMENT
Title (en)
METHOD FOR ATTACHING ELECTRONIC COMPONENTS TO A SUPPORT BY MEANS OF PRESSURE SINTERING AND CIRCUIT ARRANGEMENT
Title (de)
VERFAHREN ZUR BEFESTIGUNG VON ELEKTRONISCHEN BAUELEMENTEN AUF EINEM TRÄGER DURCH DRUCKSINTERUNG UND SCHALTUNGSANORDNUNG
Title (fr)
PROCÉDÉ DE FIXATION DE COMPOSANTS ÉLECTRONIQUES SUR UN SUPPORT PAR FRITTAGE SOUS PRESSION ET CIRCUITERIE
Publication
Application
Priority
- DE 2007001199 W 20070706
- DE 102006031844 A 20060707
Abstract (en)
[origin: WO2008003308A1] The invention relates to a method for attaching electronic components (3) to a support by means of pressure sintering comprising the steps: a) coating at least one film (1) as support with a noble metal alloy (2); b) application of a metal containing contact layer (4) to contact surfaces of the at least one electronic component (3) for attaching; c) positioning the at least one electronic component (3) on the at least one film (1) such that the at least one contact surface rests on the noble metal alloy (2) of the at least one film (1) and d) subjecting the arrangement of at least one film (1) and at least one electronic component (3) to pressure and heat for pressure sintering.
IPC 8 full level
H01L 21/60 (2006.01); C22C 14/00 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP)
H01L 23/492 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/31 (2013.01); H01L 24/83 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01093 (2013.01); H01L 2924/14 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 2008003308A1
Citation (examination)
DE 69426233 T2 20010621 - CALIFORNIA INST OF TECHN [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
DE 102006031844 A1 20080110; DE 102006031844 B4 20130411; EP 2038921 A1 20090325; WO 2008003308 A1 20080110
DOCDB simple family (application)
DE 102006031844 A 20060707; DE 2007001199 W 20070706; EP 07785597 A 20070706