EP 2039802 A1 20090325 - SURFACE TREATING METHOD BY ELECTRIC DISCHARGE, AND DRESSING METHOD
Title (en)
SURFACE TREATING METHOD BY ELECTRIC DISCHARGE, AND DRESSING METHOD
Title (de)
OBERFLÄCHENBEARBEITUNGSVERFAHREN DURCH ELEKTRISCHE ENTLADUNG UND KLEBEVERFAHREN
Title (fr)
PROCÉDÉ DE TRAITEMENT DE SURFACE PAR DÉCHARGE ÉLECTRIQUE ET PROCÉDÉ DE DRESSAGE
Publication
Application
Priority
- JP 2007062401 W 20070620
- JP 2006171556 A 20060621
Abstract (en)
To enable surface treatment of the inside of a part or the like and also simplify grinding work by equipment and a procedure that are simple in comparison with convention. A first semi-sintered electrode 31 that is formed in a tapered shape whose distal end portion becomes smaller in diameter toward the distal end portion is attached to an electrode supporting tube 26, is configured to be rotatable by a motor 27, is positioned near a seat portion 8 of a nozzle body 1, and generates electrical discharge by surface modifying electrical discharge machining method between the seat portion 8 and the first semi-sintered electrode 31, whereby a coating that is formed as a result of the material that forms the first semi-sintered electrode 31 being moved and deposited can be formed on the seat portion 8 and grinding treatment of the inside of the nozzle body 1 matching the outer diameter of a nozzle needle 2 as has conventionally been the case can be rendered unnecessary.
IPC 8 full level
C23C 26/00 (2006.01); B23H 7/22 (2006.01); C25F 3/16 (2006.01); F02M 61/16 (2006.01)
CPC (source: EP US)
B23H 1/04 (2013.01 - EP US); B23H 9/00 (2013.01 - EP US); B23H 9/008 (2013.01 - EP US); C23C 26/00 (2013.01 - EP US); F02M 61/168 (2013.01 - EP US); F02M 2200/02 (2013.01 - EP US); F02M 2200/8069 (2013.01 - EP US); Y10T 82/10 (2015.01 - EP US)
Citation (search report)
See references of WO 2007148716A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 2039802 A1 20090325; JP 4801155 B2 20111026; JP WO2007148716 A1 20091119; US 2009255822 A1 20091015; WO 2007148716 A1 20071227
DOCDB simple family (application)
EP 07845224 A 20070620; JP 2007062401 W 20070620; JP 2008522489 A 20070620; US 30554507 A 20070620