Global Patent Index - EP 2041774 A2

EP 2041774 A2 20090401 - CLUSTER TOOL FOR ADVANCED FRONT-END PROCESSING

Title (en)

CLUSTER TOOL FOR ADVANCED FRONT-END PROCESSING

Title (de)

CLUSTERWERKZEUG FÜR ERWEITERTE FRONT-END-VERARBEITUNG

Title (fr)

OUTIL MULTIPOSTE POUR UN TRAITEMENT FRONTAL AVANCE

Publication

EP 2041774 A2 20090401 (EN)

Application

EP 07812383 A 20070627

Priority

  • US 2007072264 W 20070627
  • US 80651806 P 20060703
  • US 46086406 A 20060728

Abstract (en)

[origin: WO2008005773A2] Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or precleaning steps are utilized to reduce the effect of queue time on device yield. In one aspect of the invention, a system controller and the one or more analysis chambers are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

IPC 8 full level

H01L 21/00 (2006.01)

CPC (source: EP KR)

B08B 7/0057 (2013.01 - EP); C23C 16/54 (2013.01 - EP); H01L 21/302 (2013.01 - KR); H01L 21/67 (2013.01 - KR); H01L 21/67115 (2013.01 - EP); H01L 21/6719 (2013.01 - EP); H01L 21/67196 (2013.01 - EP); H01L 21/67253 (2013.01 - EP); H01L 21/67745 (2013.01 - EP)

Citation (search report)

See references of WO 2008005773A2

Designated contracting state (EPC)

DE

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

WO 2008005773 A2 20080110; WO 2008005773 A3 20080228; EP 2041774 A2 20090401; JP 2009543355 A 20091203; KR 20090035578 A 20090409; TW 200811916 A 20080301

DOCDB simple family (application)

US 2007072264 W 20070627; EP 07812383 A 20070627; JP 2009518542 A 20070627; KR 20097002228 A 20090203; TW 96124192 A 20070703