EP 2041787 A1 20090401 - METHOD FOR ENCASING ELECTRONIC COMPONENTS AND INTEGRATED CIRCUITS
Title (en)
METHOD FOR ENCASING ELECTRONIC COMPONENTS AND INTEGRATED CIRCUITS
Title (de)
VERFAHREN ZUR VERKAPSELUNG ELEKTRONISCHER BAUELEMENTE UND INTEGRIERTER SCHALTUNGEN
Title (fr)
PROCÉDÉ D'ENCAPSULATION DE COMPOSANTS ÉLECTRONIQUES ET DE CIRCUITS INTÉGRÉS
Publication
Application
Priority
- EP 2007004847 W 20070601
- DE 102006032925 A 20060715
Abstract (en)
[origin: WO2008009328A1] The invention relates to the field of electronic components and the integrated driver circuits and/or control circuits assigned thereto, more particularly to the mechanical encasing of electronic components and the encasing of electronic components and the associated integrated driver circuits and/or control circuits thereof.
IPC 8 full level
H01L 23/053 (2006.01)
CPC (source: EP KR US)
B81C 1/0023 (2013.01 - EP US); H01L 23/053 (2013.01 - KR); H03H 9/0542 (2013.01 - EP US); H03H 9/1014 (2013.01 - EP US); H03H 9/1057 (2013.01 - EP US); H03H 9/1071 (2013.01 - EP US); H01L 2224/13 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2008009328A1
Designated contracting state (EPC)
DE FR GB NL
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2008009328 A1 20080124; AU 2007276494 A1 20080124; CA 2653918 A1 20080124; CN 101479844 A 20090708; DE 102006032925 A1 20080124; DE 102006032925 B4 20080731; DE 102006032925 B8 20081106; EP 2041787 A1 20090401; JP 2009544161 A 20091210; KR 20090031360 A 20090325; US 2010059877 A1 20100311; US 2012003791 A1 20120105; US 8017435 B2 20110913; US 8399293 B2 20130319
DOCDB simple family (application)
EP 2007004847 W 20070601; AU 2007276494 A 20070601; CA 2653918 A 20070601; CN 200780023896 A 20070601; DE 102006032925 A 20060715; EP 07725728 A 20070601; JP 2009519810 A 20070601; KR 20087030560 A 20081215; US 201113231844 A 20110913; US 30717407 A 20070601