EP 2044623 A2 20090408 - METHOD AND SYSTEM FOR ISOLATED AND DISCRETIZED PROCESS SEQUENCE INTEGRATION
Title (en)
METHOD AND SYSTEM FOR ISOLATED AND DISCRETIZED PROCESS SEQUENCE INTEGRATION
Title (de)
VERFAHREN UND SYSTEM ZUR INTEGRATION ISOLIERTER UND DISKRETISIERTER PROZESSE
Title (fr)
PROCÉDÉ ET SYSTÈME D'INTÉGRATION SÉQUENTIELLE DE TRAITEMENT ISOLÉ ET DISCRET
Publication
Application
Priority
- US 2007073368 W 20070712
- US 83224806 P 20060719
- US 67247807 A 20070207
- US 67247307 A 20070207
Abstract (en)
[origin: WO2008011329A2] A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.
IPC 8 full level
B05D 3/06 (2006.01); C23C 14/56 (2006.01); C23C 16/00 (2006.01); H01L 21/20 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 29/49 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01)
CPC (source: EP KR)
C23C 16/00 (2013.01 - KR); H01L 21/67155 (2013.01 - EP KR); H01L 21/67184 (2013.01 - KR); H01L 21/67207 (2013.01 - EP KR); H01L 21/67225 (2013.01 - EP KR); H01L 21/67236 (2013.01 - EP KR); H01L 21/67742 (2013.01 - KR); H01L 21/68707 (2013.01 - KR)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2008011329 A2 20080124; WO 2008011329 A3 20080320; CN 101490834 A 20090722; EP 2044623 A2 20090408; EP 2044623 A4 20121003; JP 2009544173 A 20091210; JP 5389645 B2 20140115; KR 101412398 B1 20140625; KR 20090060261 A 20090611
DOCDB simple family (application)
US 2007073368 W 20070712; CN 200780026564 A 20070712; EP 07840397 A 20070712; JP 2009520905 A 20070712; KR 20097001016 A 20070712