EP 2045091 A3 20090617 - Assembly and method for illustrating a surface of a substrate
Title (en)
Assembly and method for illustrating a surface of a substrate
Title (de)
Anordnung und Verfahren zur Beschriftung einer Oberfläche eines Substrats
Title (fr)
Dispositif et procédé de marquage d'une surface d'un substrat
Publication
Application
Priority
DE 102007046176 A 20070926
Abstract (en)
[origin: EP2045091A2] The laser beam passes through the substrate (SU) to a coating material (BM) behind it, on a carrier (TR). Novel use is made of a metallic carrier. The coating material comprises the carrier metal itself, or a layer comprising a chemical compound of the carrier metal. The coating material is anodized carrier metal. The carrier is aluminum and the coating material is an anodized layer of aluminum oxide. The coating material contains a mineral colorant. It contains a plastic. The holder forms a resting plane. The carrier and coating material are laid directly onto the surface to be inscribed (SO) and pressed together with given force. On the carrier, on the side carrying the coating, spacers are arranged. During operation the spacers rest against the substrate. A holder (TA) for the coating material carrier has spacer structures, on which the carrier is rested. These determine the position of the coating relative to the substrate holder. The coating material is preferably spaced 0.1-0.3 mm from the substrate surface. The carrier is plate-like. A storage cassette contains numbers of carriers and includes an automatic feeder for them. This transfers each carrier from the cassette to a position opposite the surface to be coated. The carrier is alternatively dispensed from a roll of material, as a flexible strip. The carrier is moved and guided relative to the substrate. The carrier has coating material on two opposite sides. An independent claim IS INCLUDED FOR the corresponding method of surface inscription.
IPC 8 full level
B41M 1/34 (2006.01); B41M 5/382 (2006.01)
CPC (source: EP)
B41J 2/442 (2013.01); B41M 5/38207 (2013.01); B41M 5/38221 (2013.01)
Citation (search report)
- [XY] WO 9812055 A1 19980326 - PHILIPS ELECTRONICS NV [NL], et al
- [X] US 2003071020 A1 20030417 - HONG MINGHUI [SG], et al
- [X] US 2003039765 A1 20030227 - HAYAKAWA HIROTOSHI [JP], et al
- [X] US 4743463 A 19880510 - RONN AVIGDOR M [US], et al
- [X] US 5173441 A 19921222 - YU CHANG [US], et al
- [YA] US 6130401 A 20001010 - YOO TAE KYUNG [KR], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 2045091 A2 20090408; EP 2045091 A3 20090617; DE 102007046176 A1 20090402
DOCDB simple family (application)
EP 08105180 A 20080829; DE 102007046176 A 20070926