EP 2050321 A1 20090422 - METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES
Title (en)
METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES
Title (de)
VERFAHREN ZUR HERSTELLUNG VON STRUKTURIERTEN, ELEKTRISCH LEITFÄHIGEN OBERFLÄCHEN
Title (fr)
PROCÉDÉ DE RÉALISATION DE SURFACES STRUCTURÉES CONDUCTRICES DE L'ÉLECTRICITÉ
Publication
Application
Priority
- EP 2007057858 W 20070731
- EP 06118411 A 20060803
- EP 07788054 A 20070731
Abstract (en)
[origin: WO2008015201A1] The invention relates to a method for producing structured, and/or the entire surface spanning, electrically conductive surfaces (3, 11) on an electrically nonconductive carrier 5 (1), wherein in a first step the surfaces (3) of a first level are applied to the carrier (1), in a second step the insulating layer (9) is applied at those positions, at which structured, and/or the entire surface spanning, electrically conductive surfaces (11) of a second level cross the structured, and/or the entire surface spanning, electrically conductive surfaces (3) of the first level, and no electrical contact is to occur between the structured, and/or the entire surface spanning, electrically conductive surfaces of the first level (3) and of the second level (11), in a third step the structured, and/or the entire surface spanning, electrically conductive surfaces (11) of the second level are applied according the first step, and the second and third steps are repeated, if necessary.
IPC 8 full level
CPC (source: EP KR US)
H05K 3/4664 (2013.01 - EP US); H05K 3/4685 (2013.01 - EP US); H05K 9/00 (2013.01 - KR); H05K 3/1241 (2013.01 - EP US); H05K 3/246 (2013.01 - EP US); H05K 2201/0347 (2013.01 - EP US); H05K 2203/0796 (2013.01 - EP US)
Citation (search report)
See references of WO 2008015201A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2008015201 A1 20080207; BR PI0714693 A2 20130514; CN 101524007 A 20090902; EP 2050321 A1 20090422; IL 196782 A0 20091118; JP 2009545868 A 20091224; KR 20090035019 A 20090408; RU 2394402 C1 20100710; TW 200833186 A 20080801; US 2009321123 A1 20091231
DOCDB simple family (application)
EP 2007057858 W 20070731; BR PI0714693 A 20070731; CN 200780036665 A 20070731; EP 07788054 A 20070731; IL 19678209 A 20090129; JP 2009522244 A 20070731; KR 20097004029 A 20090226; RU 2009107276 A 20070731; TW 96128644 A 20070803; US 37570207 A 20070731