Global Patent Index - EP 2050768 A1

EP 2050768 A1 20090422 - Curable silicone compositions

Title (en)

Curable silicone compositions

Title (de)

Härtbare Siliconzusammensetzungen

Title (fr)

Composition silicone réticulable

Publication

EP 2050768 A1 20090422 (DE)

Application

EP 08165609 A 20081001

Priority

DE 102007047212 A 20071002

Abstract (en)

A platinum catalyst (1) contains platinum, phosphorus and oxygen. A platinum catalyst of formula: (R 1>) 2Pt(P(OR 2>) 3) 2, contains platinum, phosphorus and oxygen. R 1>halogen, negatively charged inorganic radical, C(R 3>) 3, OR 3>, or Si(R 3>) 3(all optionally substituted by -NH 2, -COOH, -F, -Br, -Cl, aryl or alkyl); R 2>alkyl radical of formula: C nH 2n+1or C mH 2m-1, or arylalkyl of formula: -(C 6H 5-p)- or -(C oH 2o+1) p- (all optionally substituted by -NH 2, -COOH, -F, -Br, -Cl, aryl or alkyl); R 3>H, 1-18C linear or branched aliphatic radical or 6-31C arylalkyl; n : 5-18; m : 5-31; o : 1-31;and p : 1-5.

Abstract (de)

Die vorliegende Erfindung betrifft thermisch durch Hydrosilylierung vernetzbare Siliconzusammensetzungen, Verfahren zu deren Herstellung, hierzu eingesetzte Platinkatalysatoren sowie die Verwendung der vernetzbaren Zusammensetzungen.

IPC 8 full level

B01J 23/42 (2006.01); C08F 4/70 (2006.01); C08F 4/80 (2006.01); C08F 30/08 (2006.01); C08L 43/04 (2006.01)

CPC (source: EP KR US)

B01J 31/185 (2013.01 - EP US); B01J 31/22 (2013.01 - KR); B01J 31/26 (2013.01 - KR); C07C 2/38 (2013.01 - EP US); C07F 15/0086 (2013.01 - EP US); C07F 15/0093 (2013.01 - US); C08F 30/08 (2013.01 - EP US); C08G 77/08 (2013.01 - US); C08G 77/38 (2013.01 - US); C09D 143/04 (2013.01 - EP US); B01J 2231/14 (2013.01 - EP US); B01J 2231/323 (2013.01 - EP US); B01J 2531/828 (2013.01 - EP US); C07C 2531/24 (2013.01 - EP US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

BE DE FR GB NL

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 2050768 A1 20090422; EP 2050768 B1 20121205; CN 101402732 A 20090408; CN 101402732 B 20140226; DE 102007047212 A1 20090409; JP 2009082914 A 20090423; JP 5108702 B2 20121226; KR 101062264 B1 20110906; KR 20090034285 A 20090407; US 2009088524 A1 20090402; US 2016039978 A1 20160211

DOCDB simple family (application)

EP 08165609 A 20081001; CN 200810168986 A 20081006; DE 102007047212 A 20071002; JP 2008244381 A 20080924; KR 20080096615 A 20081001; US 201514918777 A 20151021; US 24010908 A 20080929