EP 2051027 A3 20141119 - Heat pump assembly
Title (en)
Heat pump assembly
Title (de)
Wärmepumpenanlage
Title (fr)
Installation de pompe de chaleur
Publication
Application
Priority
DE 102007050469 A 20071019
Abstract (en)
[origin: EP2051027A2] The system has valves (20, 21) provided in front of an evaporator (3), and valves (17, 18) provided behind the evaporator. Two paths (B, C) are provided parallel to the evaporator. The valves (17, 18, 20, 21) are designed such that a flow direction at the evaporator is unchanged independent of change of a flow direction of a refrigerant e.g. carbon hydride. The evaporator is used as a liquefier in an operation mode for liquefying the refrigerant and is used as a vaporizer in another operation mode for evaporating the refrigerant.
IPC 8 full level
F25B 13/00 (2006.01)
CPC (source: EP)
F25B 13/00 (2013.01); F25B 40/00 (2013.01); F25B 2313/02741 (2013.01); F25B 2313/02742 (2013.01); F25B 2400/13 (2013.01)
Citation (search report)
- [XY] JP H1073334 A 19980317 - SANYO ELECTRIC CO
- [X] JP 2003042583 A 20030213 - SAGINOMIYA SEISAKUSHO INC
- [Y] JP 2001066006 A 20010316 - DAIKIN IND LTD
- [Y] US 2006048526 A1 20060309 - LIFSON ALEXANDER [US], et al
- [Y] WO 2007111303 A1 20071004 - DAIKIN IND LTD [JP], et al
- [A] EP 0685693 A2 19951206 - SANYO ELECTRIC CO [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 2051027 A2 20090422; EP 2051027 A3 20141119; EP 2051027 B1 20180516; DE 102007050469 A1 20090423
DOCDB simple family (application)
EP 08018307 A 20081020; DE 102007050469 A 20071019