EP 2051032 A1 20090422 - HEAT PIPE AND METHOD OF MANUFACTURING IT
Title (en)
HEAT PIPE AND METHOD OF MANUFACTURING IT
Title (de)
HEIZROHR UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
TUYAU CHAUFFANT ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- JP 2007053509 W 20070226
- JP 2006206160 A 20060728
Abstract (en)
It is an object of the invention to provide a heat pipe which can ensure the sealing effect under a high temperature condition, and has a further long life in comparison with the conventional ones, and a method for manufacturing the same. Another object of the invention is to provide a heat pipe which has an improved productivity and reduces the cost, and, has a further long life in comparison with the conventional ones. According to a heat pipe 1 of the invention, an upper plate reinforcement member 50, an intermediate plate reinforcement member 52, a slit-provided reinforcement member 55 and a lower plate reinforcement member 60 adhere tightly to one another to form a support structure in vapor diffusion flow paths 44 facing the peripheral regions of a refrigerant charging hole 4 and an air outlet port 5. Therefore, the heat pipe 1 can receive external force from a press 75 by the support structure constituted by the upper plate reinforcement member 50, the intermediate reinforcement member 52, the slit-provided reinforcement member 55, and the lower plate reinforcement member 60, thus preventing an upper plate 2 or a lower plate 3 from being damaged by that external force and an interior space 10a from being crushed.
IPC 8 full level
F28D 15/02 (2006.01)
CPC (source: EP KR US)
F28D 15/02 (2013.01 - KR); F28D 15/0233 (2013.01 - EP US); F28D 15/0283 (2013.01 - US); F28D 15/046 (2013.01 - EP US); F28D 21/00 (2013.01 - KR)
Citation (search report)
See references of WO 2008012960A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 2051032 A1 20090422; CN 101421577 A 20090429; CN 101421577 B 20110803; JP 4035155 B1 20080116; JP WO2008012960 A1 20091217; KR 20090045146 A 20090507; TW 200817646 A 20080416; TW I409424 B 20130921; US 2021310745 A1 20211007; WO 2008012960 A1 20080131
DOCDB simple family (application)
EP 07714941 A 20070226; CN 200780013612 A 20070226; JP 2007053509 W 20070226; JP 2007510405 A 20070226; KR 20087022416 A 20080912; TW 96123746 A 20070629; US 99393907 A 20070226