EP 2060644 A4 20160217 - MARTENSITIC STAINLESS STEEL
Title (en)
MARTENSITIC STAINLESS STEEL
Title (de)
MARTENSITISCHER NICHTROSTENDER STAHL
Title (fr)
ACIER INOXYDABLE MARTENSITIQUE
Publication
Application
Priority
- JP 2007066194 W 20070821
- JP 2006225261 A 20060822
Abstract (en)
[origin: EP2060644A1] The martensitic stainless steel according to the invention includes, in percent by mass, 0.010% to 0.030% C, 0.30% to 0.60% Mn, at most 0.040% P, at most 0.0100% S, 10.00% to 15.00% Cr, 2.50% to 8.00% Ni, 1.00% to 5.00% Mo, 0.050% to 0.250% Ti, at most 0.25% V, at most 0.07% N, and at least one of at most 0.50% Si and at most 0.10% Al, the balance consists of Fe and impurities, and the martensitic stainless steel satisfies Expression (1) and has a yield stress in the range from 758 MPa to 862 MPa. In this way, the martensitic stainless steel has a yield stress of 110 ksi grade (a yield stress in the range from 758 MPa to 862 MPa) and the value produced by subtracting the yield stress from the tensile stress is not less than 20.7 MPa. 6.0 ‰¤ Ti / C ‰¤ 10.1
IPC 8 full level
C22C 38/00 (2006.01); C22C 38/04 (2006.01); C22C 38/18 (2006.01); C22C 38/40 (2006.01); C22C 38/44 (2006.01); C22C 38/50 (2006.01)
CPC (source: EP US)
C22C 38/001 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/06 (2013.01 - EP US); C22C 38/42 (2013.01 - EP US); C22C 38/44 (2013.01 - EP US); C22C 38/46 (2013.01 - EP US); C22C 38/50 (2013.01 - EP US); C21D 1/25 (2013.01 - EP US); C21D 6/004 (2013.01 - EP US); C21D 9/14 (2013.01 - EP US)
Citation (search report)
- [X] JP 2003003243 A 20030108 - SUMITOMO METAL IND
- [X] JP H10130785 A 19980519 - SUMITOMO METAL IND
- [X] EP 1584699 A1 20051012 - SUMITOMO METAL IND [JP] & WO 2004057050 A1 20040708 - SUMITOMO METAL IND [JP], et al
- See references of WO 2008023702A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 2060644 A1 20090520; EP 2060644 A4 20160217; BR PI0719904 A2 20140610; BR PI0719904 B1 20181121; CN 101506400 A 20090812; JP 5124857 B2 20130123; JP WO2008023702 A1 20100114; MX 2009001836 A 20090430; NO 20090712 L 20090519; RU 2009110199 A 20100927; RU 2416670 C2 20110420; US 2009162239 A1 20090625; WO 2008023702 A1 20080228
DOCDB simple family (application)
EP 07792794 A 20070821; BR PI0719904 A 20070821; CN 200780031149 A 20070821; JP 2007066194 W 20070821; JP 2008530919 A 20070821; MX 2009001836 A 20070821; NO 20090712 A 20090213; RU 2009110199 A 20070821; US 37939509 A 20090220