EP 2060658 B1 20100714 - Method for processing a structured surface
Title (en)
Method for processing a structured surface
Title (de)
Verfahren zur Bearbeitung einer strukturierten Oberfläche
Title (fr)
Procédé de traitement d'une surface structurée
Publication
Application
Priority
DE 102007055053 A 20071116
Abstract (en)
[origin: EP2060658A2] The method for treating a surface of an embossing tool such as a press plate (1) or an endless belt, comprises applying a first mask on the surface for fine structuring, chemically treating the surface provided with the first mask for obtaining a surface structure, applying a second mask on the chemically treated surface for pore structuring, chemically treating the surface provided with the second mask for obtaining the surface structure, applying a third mask on the chemically treated surface, and chemically treating the surface provided with the third mask. The method for treating a surface of an embossing tool such as a press plate (1) or an endless belt, comprises applying a first mask on the surface for fine structuring, chemically treating the surface provided with the first mask for obtaining a surface structure, applying a second mask on the chemically treated surface for pore structuring, chemically treating the surface provided with the second mask for obtaining the surface structure, applying a third mask on the chemically treated surface, chemically treating the surface provided with the third mask, polishing the chemically treated surface, activating the polished surface, cleaning the activated surface, chrome-plating the cleaned surface, applying a fourth mask on the chrome-plated surface, and chrome-plating the surface chrome-plated with the fourth mask. The masks are applied by the digital printing technique. Independent claims are included for: (1) a method for treating a structured surface of an embossing tool; and (2) an embossing tool.
IPC 8 full level
C23C 18/16 (2006.01)
CPC (source: EP)
B30B 15/06 (2013.01); B30B 15/062 (2013.01); B44B 5/026 (2013.01); B44C 1/227 (2013.01); B44C 3/025 (2013.01); C23C 18/1605 (2013.01); C23C 18/1651 (2013.01); C23C 18/1844 (2013.01); B30B 5/04 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2060658 A2 20090520; EP 2060658 A3 20090617; EP 2060658 B1 20100714; AT E474074 T1 20100715; CN 101861411 A 20101013; CN 101861411 B 20120808; DE 102007055053 A1 20090520; DE 502007004418 D1 20100826; ES 2348748 T3 20101213; HK 1145344 A1 20110415; JP 2011503357 A 20110127; JP 5544623 B2 20140709; PL 2060658 T3 20110331; RU 2010114874 A 20111227; RU 2492278 C2 20130910; WO 2009062488 A2 20090522; WO 2009062488 A3 20100318
DOCDB simple family (application)
EP 07023647 A 20071206; AT 07023647 T 20071206; CN 200880116257 A 20081113; DE 102007055053 A 20071116; DE 2008001872 W 20081113; DE 502007004418 T 20071206; ES 07023647 T 20071206; HK 10111810 A 20101216; JP 2010533430 A 20081113; PL 07023647 T 20071206; RU 2010114874 A 20081113