Global Patent Index - EP 2062709 B1

EP 2062709 B1 20120613 - Boards made from wood fibres using a bonding agent

Title (en)

Boards made from wood fibres using a bonding agent

Title (de)

Platten auf der Basis von mit Bindemittel beleimten Holzfasern

Title (fr)

Plaques à base de fibres de bois encollées à l'aide d'un liant

Publication

EP 2062709 B1 20120613 (DE)

Application

EP 07022728 A 20071123

Priority

EP 07022728 A 20071123

Abstract (en)

[origin: EP2062709A1] The board has a molded density profile on a wood fiberboard with a center molded density of approximately 60 kilograms/meter cube. The profile is sectioned into two cover layers and has a center layer lying between the cover layers. Small parts e.g. fibers containing lignocellulose, in the board are glued with a bonding agent to form a preform (6). The molded density of the board is increased from the center layer to one cover layer. One molded density of the board in an area of the center layer is larger than another molded density of the board in an area of another cover layer.

IPC 8 full level

B27N 3/08 (2006.01)

CPC (source: EP)

B27N 3/08 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2062709 A1 20090527; EP 2062709 B1 20120613; ES 2389509 T3 20121026; PT 2062709 E 20120827

DOCDB simple family (application)

EP 07022728 A 20071123; ES 07022728 T 20071123; PT 07022728 T 20071123