Global Patent Index - EP 2062932 A4

EP 2062932 A4 20130102 - INTERPENETRATING POLYMER NETWORK STRUCTURE AND POLISHING PAD AND PROCESSES FOR PRODUCING THEM

Title (en)

INTERPENETRATING POLYMER NETWORK STRUCTURE AND POLISHING PAD AND PROCESSES FOR PRODUCING THEM

Title (de)

INTERPENETRIERENDE POLYMERNETZWERKSTRUKTUR UND POLIERKISSEN UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

STRUCTURE DE RÉSEAUX POLYMÈRES INTERPÉNÉTRÉS ET TAMPON DE POLISSAGE ET PROCÉDÉS PERMETTANT DE LES FABRIQUER

Publication

EP 2062932 A4 20130102 (EN)

Application

EP 06781860 A 20060728

Priority

JP 2006314950 W 20060728

Abstract (en)

[origin: EP2062932A1] The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.

IPC 8 full level

C08J 5/14 (2006.01); B24B 37/00 (2012.01); B24B 37/24 (2012.01); C08F 2/38 (2006.01); C08F 283/00 (2006.01); C08J 3/24 (2006.01); C08J 9/36 (2006.01); C08L 33/10 (2006.01); H01L 21/304 (2006.01)

CPC (source: EP KR US)

B24B 37/24 (2013.01 - EP KR US); B24D 18/0027 (2013.01 - EP US); C08F 2/38 (2013.01 - EP US); C08F 2/40 (2013.01 - EP US); C08F 265/04 (2013.01 - EP US); C08F 283/00 (2013.01 - EP US); C08J 3/246 (2013.01 - EP US); C08J 5/00 (2013.01 - KR); C08J 9/36 (2013.01 - KR); C08L 33/10 (2013.01 - EP US); H01L 21/304 (2013.01 - KR); C08L 75/00 (2013.01 - EP US); C08L 2205/04 (2013.01 - EP US)

C-Set (source: EP US)

C08L 33/10 + C08L 75/04

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2062932 A1 20090527; EP 2062932 A4 20130102; EP 2062932 B1 20130911; CN 101501112 A 20090805; CN 101501112 B 20111214; KR 101276962 B1 20130619; KR 20090036147 A 20090413; US 2009280723 A1 20091112; US 8314192 B2 20121120; WO 2008012909 A1 20080131

DOCDB simple family (application)

EP 06781860 A 20060728; CN 200680055460 A 20060728; JP 2006314950 W 20060728; KR 20097004282 A 20060728; US 37537109 A 20090127