EP 2063484 A1 20090527 - Microwave module
Title (en)
Microwave module
Title (de)
Mikrowellenmodul
Title (fr)
Module de micro-onde
Publication
Application
Priority
EP 07425745 A 20071126
Abstract (en)
A Microwave Module in the form of a sealed enclosure comprising: a back of said enclosure, a cover of said enclosure, characterized in that a plurality of spring contacts are placed between said back and said cover, and by comprising a waveguide flange. ( Fig. 1 )
IPC 8 full level
H01P 1/00 (2006.01); H01P 5/107 (2006.01)
CPC (source: EP)
H01P 1/00 (2013.01); H01P 5/107 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/19107 (2013.01)
C-Set (source: EP)
Citation (applicant)
- WO 0051012 A2 20000831 - FORMFACTOR INC [US]
- JP 2002094260 A 20020329 - MITSUBISHI ELECTRIC CORP
- US 6573803 B1 20030603 - ZIEGNER BERNHARD ALPHONSO [US], et al
Citation (search report)
- [Y] WO 0051012 A2 20000831 - FORMFACTOR INC [US]
- [Y] JP 2002094260 A 20020329 - MITSUBISHI ELECTRIC CORP
- [A] US 6573803 B1 20030603 - ZIEGNER BERNHARD ALPHONSO [US], et al
- [A] US 2006001129 A1 20060105 - STONEHAM EDWARD B [US], et al
- [A] US 4166256 A 19790828 - SHISHIDO TSUNEO [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 2063484 A1 20090527; EP 2063484 B1 20091028; AT E447243 T1 20091115; DE 602007003031 D1 20091210; ES 2334399 T3 20100309
DOCDB simple family (application)
EP 07425745 A 20071126; AT 07425745 T 20071126; DE 602007003031 T 20071126; ES 07425745 T 20071126