Global Patent Index - EP 2066147 B1

EP 2066147 B1 20130417 - Micro-heaters, micro-heater arrays, methods for manufacturing the same and electronic devices using the same

Title (en)

Micro-heaters, micro-heater arrays, methods for manufacturing the same and electronic devices using the same

Title (de)

Mikroerhitzer, Mikroerhitzer-Arrays, Herstellungsverfahren dafür und elektronische Vorrichtungen damit

Title (fr)

Micro-réchauffeurs, réseaux de micro-réchauffeur, leurs procédés de fabrication et dispositifs électroniques l'utilisant

Publication

EP 2066147 B1 20130417 (EN)

Application

EP 08157114 A 20080528

Priority

KR 20070123797 A 20071130

Abstract (en)

[origin: EP2066147A2] Example embodiments provide micro-heaters including a heating section, a plurality of connecting sections, and a plurality of support structures. The heating section is on the substrate, separated from the substrate and extended in a longitudinal direction. The plurality of connecting sections are arranged at a distance from each other in the longitudinal direction of the heating section, and extended from two sides of the heating section in a perpendicular direction with respect to the longitudinal direction of the heating section. The plurality of support structures are formed between the substrate and the plurality of connecting sections, so as to support the heating section and the plurality of connecting sections from underneath the plurality of connecting sections. Therefore, since the heating section and the plurality of support structures are separated from each other by the plurality of connecting sections, temperature distribution on the heating section is not influenced by the shape of each one of the plurality of support structures. Consequently, temperature distribution on the heating section may be more uniform and power consumption of the micro-heater may decrease.

IPC 8 full level

H05B 3/26 (2006.01)

CPC (source: EP KR US)

H05B 3/02 (2013.01 - KR); H05B 3/26 (2013.01 - EP US); H05B 2203/002 (2013.01 - EP US); H05B 2203/017 (2013.01 - EP US); H05B 2214/04 (2013.01 - EP US)

Designated contracting state (EPC)

DE GB NL

DOCDB simple family (publication)

EP 2066147 A2 20090603; EP 2066147 A3 20111019; EP 2066147 B1 20130417; KR 101318292 B1 20131018; KR 20090056583 A 20090603; US 2009139974 A1 20090604; US 8357879 B2 20130122

DOCDB simple family (application)

EP 08157114 A 20080528; KR 20070123797 A 20071130; US 14994708 A 20080509