EP 2066497 A4 20141210 - MANUFACTURING METHODS FOR METAL CLAD LAMINATES
Title (en)
MANUFACTURING METHODS FOR METAL CLAD LAMINATES
Title (de)
HERSTELLUNGSVERFAHREN FÜR METALLKASCHIERTE LAMINATE
Title (fr)
PROCÉDÉS DE FABRICATION DE STRATIFIÉS REVÊTUS DE MÉTAL
Publication
Application
Priority
- KR 2007003737 W 20070802
- KR 20060074311 A 20060807
- KR 20060074388 A 20060807
Abstract (en)
[origin: WO2008018719A1] The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.
IPC 8 full level
B32B 15/08 (2006.01); C25D 5/48 (2006.01); C25D 5/56 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP US)
C25D 5/48 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US); H05K 3/022 (2013.01 - EP US); H05K 3/105 (2013.01 - EP US); H05K 3/246 (2013.01 - EP US); H05K 2203/0723 (2013.01 - EP US); H05K 2203/1157 (2013.01 - EP US); H05K 2203/125 (2013.01 - EP US); Y10T 428/12396 (2015.01 - EP US); Y10T 428/12896 (2015.01 - EP US)
Citation (search report)
- [Y] US 2003108664 A1 20030612 - KODAS TOIVO T [US], et al
- [Y] US 2699424 A 19550111 - TEMPLE NIETER
- [A] US 2003180448 A1 20030925 - BROOK-LEVINSON EDWARD [IL], et al
- [A] US 2003171003 A1 20030911 - KIM JAE-JEONG [KR], et al
- [XP] WO 2006083153 A1 20060810 - INKTEC CO LTD [KR], et al
- See references of WO 2008018719A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008018719 A1 20080214; AR 062235 A1 20081022; EP 2066497 A1 20090610; EP 2066497 A4 20141210; EP 2066497 B1 20181107; JP 2010500476 A 20100107; JP 5139429 B2 20130206; TW 200813257 A 20080316; TW I357447 B 20120201; US 2010261031 A1 20101014; US 8764960 B2 20140701
DOCDB simple family (application)
KR 2007003737 W 20070802; AR P070103478 A 20070807; EP 07807946 A 20070802; JP 2009523712 A 20070802; TW 96128937 A 20070807; US 37689207 A 20070802