EP 2067163 A4 20091202 - MASKING OF AND MATERIAL CONSTRAINT FOR DEPOSITING BATTERY LAYERS ON FLEXIBLE SUBSTRATES
Title (en)
MASKING OF AND MATERIAL CONSTRAINT FOR DEPOSITING BATTERY LAYERS ON FLEXIBLE SUBSTRATES
Title (de)
MASKIERUNG VON FLEXIBLEN SUBSTRATEN UND MATERIALBESCHRÄNKUNG ZUM AUFBRINGEN VON BATTERIESCHICHTEN AUF DIESE
Title (fr)
MASQUAGE DE, ET CONTRAINTE DE MATÉRIAU, POUR DÉPOSER DES COUCHES DE BATTERIE SUR DES SUBSTRATS FLEXIBLES
Publication
Application
Priority
- US 2007020720 W 20070926
- US 82768506 P 20060929
Abstract (en)
[origin: WO2008039471A2] The present invention relates to masking techniques and apparatuses, and in particular, to a method and apparatus for masking a flexible substrate to be coated with one or more material layers. The method involves flexing a substrate to provide a curved surface and providing a flexible sheet on the curved surface to properly apply a coating on the surface of the substrate. The apparatus includes a substrate and a flexible sheet. An elastic material, such as a spring pin, or an off-axis roll-down bar may be used to create the tension used to flex the substrate and or flexible sheet.
IPC 8 full level
H01L 21/31 (2006.01); H01M 10/058 (2010.01); H01M 10/38 (2006.01)
CPC (source: EP KR US)
C23C 14/042 (2013.01 - EP US); C23C 16/042 (2013.01 - EP US); H01L 21/31 (2013.01 - KR); H01M 4/0421 (2013.01 - EP US); H01M 6/40 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP); Y10T 156/1028 (2015.01 - EP US)
Citation (search report)
- [X] JP 2005256101 A 20050922 - MITSUI SHIPBUILDING ENG, et al
- [X] JP 2004158268 A 20040603 - SONY CORP
- [X] JP 2002344115 A 20021129 - MATSUSHITA ELECTRIC IND CO LTD
- See references of WO 2008039471A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008039471 A2 20080403; WO 2008039471 A3 20080703; CN 101523571 A 20090902; EP 2067163 A2 20090610; EP 2067163 A4 20091202; JP 2010505044 A 20100218; KR 20090069323 A 20090630; TW 200828603 A 20080701; US 2008078496 A1 20080403; US 8062708 B2 20111122
DOCDB simple family (application)
US 2007020720 W 20070926; CN 200780035960 A 20070926; EP 07861371 A 20070926; JP 2009530401 A 20070926; KR 20097008750 A 20090428; TW 96136394 A 20070928; US 86150107 A 20070926