EP 2073985 A4 20091104 - PROCESS AND DEVICE FOR CONTINUOUS TREATMENT OF A WEB SUBSTRATE
Title (en)
PROCESS AND DEVICE FOR CONTINUOUS TREATMENT OF A WEB SUBSTRATE
Title (de)
VERFAHREN UND VORRICHTUNG ZUR KONTINUIERLICHEN BEHANDLUNG EINES BAHNSUBSTRATS
Title (fr)
PROCÉDÉ ET DISPOSITIF DE TRAITEMENT CONTINU D'UN SUBSTRAT EN NAPPE
Publication
Application
Priority
NO 2006000347 W 20061006
Abstract (en)
[origin: WO2008041858A1] A process and a device system for continuous treatment of a web substrate (7), after printing processes and integrated between printer technologies and finishing processes, comprising a control device (1) ensuring a correct feeding tension and sufficient buffer capacity of the substrate, tempering the substrate to ensure a desired temperature in the substrate, coating the substrate by aggregates in a feeding system (6), controlling the substrate temperature, the relative substrate humidity, the static substrate load as well as the coating thickness, volume of the substrate and the roller pressures of the aggregates by a computer based on readings from sensors along the path of the substrate, depending on the speed by which the substrate is leaving the previous printing process.
IPC 8 full level
B41F 23/02 (2006.01); B41F 23/04 (2006.01); B41F 23/08 (2006.01); B41M 7/02 (2006.01)
CPC (source: EP)
B41F 23/02 (2013.01); B41F 23/0476 (2013.01); B41F 23/08 (2013.01)
Citation (search report)
- [XY] US 5935637 A 19990810 - CALDWELL JAMES MICHAEL [US], et al
- [X] US 2002069826 A1 20020613 - HUNT ANDREW T [US], et al
- [Y] US 6166366 A 20001226 - LEWIS CLARENCE A [US], et al
- [Y] US 5368891 A 19941129 - SAGARA TOSHIHARU [JP], et al
- See references of WO 2008041858A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008041858 A1 20080410; EP 2073985 A1 20090701; EP 2073985 A4 20091104
DOCDB simple family (application)
NO 2006000347 W 20061006; EP 06812769 A 20061006