EP 2075802 B1 20131120 - CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD
Title (en)
CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD
Title (de)
FOLIE ZUR FORMUNG EINER LEITFÄHIGEN STRUKTUR, VERFAHREN ZUR FORMUNG EINER LEITFÄHIGEN STRUKTUR
Title (fr)
FILM DE FORMATION D'IMPRESSION CONDUCTRICE, ET PROCÉDÉ DE FORMATION D'IMPRESSION CONDUCTRICE
Publication
Application
Priority
- JP 2007070230 W 20071017
- JP 2006284445 A 20061019
- JP 2007268168 A 20071015
Abstract (en)
[origin: EP2075802A1] The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same. The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement surface, and a driving body for pressure application which is placed in a manner facing the placement surface and movable, wherein the driving body for pressure application is equipped with a support which is constituted by a flat metal panel having metal spheres along its bottom face.
IPC 8 full level
H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP KR US)
H01B 1/22 (2013.01 - KR); H01B 13/0016 (2013.01 - KR); H01B 13/0026 (2013.01 - KR); H05K 1/0393 (2013.01 - KR); H05K 1/09 (2013.01 - KR); H05K 3/102 (2013.01 - EP KR US); H05K 3/1283 (2013.01 - EP KR US); H05K 1/0393 (2013.01 - EP US); H05K 2201/0257 (2013.01 - EP KR US); H05K 2203/0278 (2013.01 - EP KR US); H05K 2203/1105 (2013.01 - EP KR US)
Citation (examination)
- US 6238597 B1 20010529 - YIM MYUNG JIN [KR], et al
- US 2003213614 A1 20031120 - FURUSAWA MASAHIRO [JP], et al
- EP 1398673 A2 20040317 - CANON KK [JP]
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 2075802 A1 20090701; EP 2075802 A4 20101103; EP 2075802 B1 20131120; JP 2008124446 A 20080529; JP 5252473 B2 20130731; KR 20090064445 A 20090618; US 2010025088 A1 20100204; US 8278561 B2 20121002; WO 2008047823 A1 20080424
DOCDB simple family (application)
EP 07829964 A 20071017; JP 2007070230 W 20071017; JP 2007268168 A 20071015; KR 20097007319 A 20090409; US 44348207 A 20071017