EP 2076343 A4 20091223 - APPARATUS AND METHOD FOR DRYING METAL CHIPS BEFORE PROCESSING IN MOLDING SYSTEM
Title (en)
APPARATUS AND METHOD FOR DRYING METAL CHIPS BEFORE PROCESSING IN MOLDING SYSTEM
Title (de)
VORRICHTUNG UND VERFAHREN ZUM TROCKNEN VON METALLSPÄNEN VOR DER VERARBEITUNG IN EINEM FORMSYSTEM
Title (fr)
APPAREIL ET PROCEDE PERMETTANT DE SECHER DES COPEAUX METALLQUES AVANT TRAITEMENT DANS UN SYSTEME DE MOULAGE
Publication
Application
Priority
- CA 2007001603 W 20070913
- US 53816006 A 20061003
Abstract (en)
[origin: US2008079202A1] Disclosed is: (i) a sub-system of a metal molding system, including (amongst other things) a conditioner, (ii) a metal molding system, including a conditioner, (iii) a metallic molded article manufactured by the use of a metal molding system having a conditioner, (iv) a method of a metal molding system, comprising conditioning, at least in part, metal chips, (v) a metallic molded article manufactured by the use of a method of a metal molding system, including conditioning, at least in part, metal chips, (vi) a molding material, including metal chips being conditioned, at least in part, (vii) a molten molding material, including a molten metallic melt being made from metal chips being conditioned, at least in part, and/or (viii) a metallic molded article, including a solidified molding material having been made from metal chips being conditioned, at least in part, amongst other things.
IPC 8 full level
B22D 17/30 (2006.01); B22D 17/20 (2006.01); B29C 45/17 (2006.01); B29C 45/18 (2006.01); B29C 45/72 (2006.01)
CPC (source: EP US)
B22D 17/007 (2013.01 - EP US); B22D 17/2061 (2013.01 - EP US); B22D 17/30 (2013.01 - EP US); B22F 3/003 (2013.01 - EP US); B22F 3/225 (2013.01 - EP US); Y10T 428/12014 (2015.01 - EP US)
Citation (search report)
- [X] JP 2000334773 A 20001205 - SATO KASEI KOGYOSHO KK
- [X] JP 2000334774 A 20001205 - SATO KASEI KOGYOSHO KK
- [X] JP 2001205417 A 20010731 - JAPAN STEEL WORKS LTD
- [X] KR 20050093911 A 20050923 - SHIN SANG O [KR] & DATABASE WPI Week 200654, Derwent World Patents Index; AN 2006-526527
- [X] JP 2006168083 A 20060629 - DAIICHI KASEI
- [X] US 5983978 A 19991116 - VINING RALPH [US], et al
- See references of WO 2008040115A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
US 2008079202 A1 20080403; CA 2662370 A1 20080410; EP 2076343 A1 20090708; EP 2076343 A4 20091223; TW 200824816 A 20080616; WO 2008040115 A1 20080410
DOCDB simple family (application)
US 53816006 A 20061003; CA 2007001603 W 20070913; CA 2662370 A 20070913; EP 07815807 A 20070913; TW 96136482 A 20070928