EP 2084213 A1 20090805 - COMPOSITION WITH THERMALLY-TREATED SILICA FILLER FOR PERFORMANCE ENHANCEMENT
Title (en)
COMPOSITION WITH THERMALLY-TREATED SILICA FILLER FOR PERFORMANCE ENHANCEMENT
Title (de)
ZUSAMMENSETZUNG MIT THERMISCH BEHANDELTEM SILICIUMDIOXIDFÜLLSTOFF ZUR LEISTUNGSSTEIGERUNG
Title (fr)
COMPOSITION CONTENANT UNE CHARGE DE SILICE TRAITÉE THERMIQUEMENT POUR UNE AMÉLIORATION DE L'EFFICACITÉ
Publication
Application
Priority
- US 2007083319 W 20071101
- US 85624506 P 20061102
Abstract (en)
[origin: WO2008057931A1] A curable composition comprising a curable resin and a thermally-treated silica filler, when used as an underfill material in semiconductor packages provides improved flow behavior, reduction in CTE, and enhancement of modulus, leading to reduced warpage. In one embodiment, the curable composition comprises (a) a thermally treated silica filler, (b) a curable resin (c) an initiator, and (d) optionally, adhesion promoters and/or wetting agents. The curable resins can be cyanate ester resins, epoxy resins, maleimide resins, or acrylate or methacrylate resins.
IPC 8 full level
C08J 3/24 (2006.01); C08K 3/36 (2006.01); C08K 9/04 (2006.01)
CPC (source: EP KR)
C08J 3/24 (2013.01 - KR); C08K 3/36 (2013.01 - EP KR); C08K 9/04 (2013.01 - KR); C08L 101/00 (2013.01 - KR)
Citation (search report)
See references of WO 2008057931A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008057931 A1 20080515; CN 101535379 A 20090916; EP 2084213 A1 20090805; JP 2010509410 A 20100325; KR 20090090324 A 20090825; TW 200920779 A 20090516
DOCDB simple family (application)
US 2007083319 W 20071101; CN 200780040597 A 20071101; EP 07863777 A 20071101; JP 2009535463 A 20071101; KR 20097011314 A 20071101; TW 97109759 A 20080320