Global Patent Index - EP 2084938 B2

EP 2084938 B2 20210224 - DEVICE FOR LAYING DOWN A THIN METAL WIRE ON A SURFACE

Title (en)

DEVICE FOR LAYING DOWN A THIN METAL WIRE ON A SURFACE

Title (de)

VORRICHTUNG ZUR DEPOSITION EINES DÜNNEN METALLDRAHTES AUF EINER OBERFLÄCHE

Title (fr)

DISPOSITIF POUR DEPOSER UN MINCE FIL METALLIQUE SUR UNE SURFACE

Publication

EP 2084938 B2 20210224 (FR)

Application

EP 07766117 A 20070530

Priority

  • FR 2007051350 W 20070530
  • DE 102006025893 A 20060602

Abstract (en)

[origin: US2009206191A1] A device for laying a thin metal wire taken from a coil of wire stock onto a surface, in particular onto the surface of a sheet, using a presser. The device includes a mechanism exerting mechanical tension in a region of the wire that lies between the rotary coil of wire stock and the presser, and a wire-guiding device provided in the region. The wire-guiding device includes a tensioning device that acts directly on the wire taken off the coil of wire stock. That makes it possible effectively and appreciably to compensate for changes in relative speeds at which the wire and the sheet progress.

IPC 8 full level

H05B 3/86 (2006.01); H05B 3/84 (2006.01)

CPC (source: EP US)

H05B 3/86 (2013.01 - EP US); H05B 2203/017 (2013.01 - EP US)

Citation (opposition)

Opponent :

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2009206191 A1 20090820; AT E523063 T1 20110915; DE 102006025893 A1 20071206; EP 2084938 A1 20090805; EP 2084938 B1 20110831; EP 2084938 B2 20210224; ES 2371199 T3 20111228; PL 2084938 T3 20120131; PL 2084938 T5 20210816; PT 2084938 E 20111220; WO 2007141442 A1 20071213

DOCDB simple family (application)

US 30319407 A 20070530; AT 07766117 T 20070530; DE 102006025893 A 20060602; EP 07766117 A 20070530; ES 07766117 T 20070530; FR 2007051350 W 20070530; PL 07766117 T 20070530; PT 07766117 T 20070530