Global Patent Index - EP 2086699 B1

EP 2086699 B1 20100825 - METHOD FOR OBTAINING WORKPIECE CUTOUTS FROM A PLATE-LIKE WORKPIECE

Title (en)

METHOD FOR OBTAINING WORKPIECE CUTOUTS FROM A PLATE-LIKE WORKPIECE

Title (de)

VERFAHREN ZUR GEWINNUNG VON WERKSTÜCKAUSSCHNITTEN AUS EINEM PLATTENARTIGEN WERKSTÜCK

Title (fr)

PROCEDE POUR OBTENIR DES DECOUPES A PARTIR D'UNE PIECE DU GENRE PLAQUE

Publication

EP 2086699 B1 20100825 (DE)

Application

EP 07818794 A 20071009

Priority

  • EP 2007008720 W 20071009
  • DE 102006050018 A 20061024

Abstract (en)

[origin: US2009223334A1] A plate workpiece processing method for obtaining at least two workpiece cut-outs from a plate workpiece. The method includes utilizing one or more cutting devices of a machine tool to perform a first cutting operation and a second cutting operation on a plate workpiece. During the first cutting operation, with the plate workpiece moving relative to the cutting device or cutting devices used for the first cutting operation, at least two workpiece cut-outs are partially formed in the plate workpiece with only a common residual connection being left that jointly connects the partially formed workpiece cut-outs to a remaining portion of the plate workpiece and that is shortened along one or more cutting lines of the second cutting operation to a size that fits within a working area of the cutting device or cutting devices used for the second cutting operation. During the second cutting operation, with the plate workpiece being maintained stationary relative to a workpiece support of the machine tool, the shortened common residual connection is severed, via the cutting device or cutting devices used for the second cutting operation, along the one or more cutting lines of the second cutting operation to completely separate the workpiece cut-outs from the remaining portion of the plate workpiece.

IPC 8 full level

B21D 28/10 (2006.01); B21D 28/06 (2006.01); B23K 26/38 (2014.01)

CPC (source: EP US)

B21D 28/06 (2013.01 - EP US); B21D 28/10 (2013.01 - EP US); B21D 35/003 (2013.01 - EP US); Y10T 83/0457 (2015.04 - EP US); Y10T 83/0524 (2015.04 - EP US); Y10T 83/9428 (2015.04 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2009223334 A1 20090910; US 7992475 B2 20110809; AT E478743 T1 20100915; CN 101534974 A 20090916; CN 101534974 B 20120613; DE 102006050018 A1 20080430; DE 502007004879 D1 20101007; EP 2086699 A1 20090812; EP 2086699 B1 20100825; JP 2010507486 A 20100311; JP 5404408 B2 20140129; WO 2008049509 A1 20080502

DOCDB simple family (application)

US 42874809 A 20090423; AT 07818794 T 20071009; CN 200780039680 A 20071009; DE 102006050018 A 20061024; DE 502007004879 T 20071009; EP 07818794 A 20071009; EP 2007008720 W 20071009; JP 2009533685 A 20071009