Global Patent Index - EP 2096473 B1

EP 2096473 B1 20120808 - OPTICAL / ELECTRICAL HYBRID CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

Title (en)

OPTICAL / ELECTRICAL HYBRID CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

Title (de)

OPTISCHE / ELEKTRISCHE HYBRID-SCHALTUNGSTRAEGERPLATTE UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

PLATINE DE CIRCUIT MIXTE OPTIQUE / ELECTRIQUE ET PROCEDE DE FABRICATION DE CELLE-CI

Publication

EP 2096473 B1 20120808 (EN)

Application

EP 07859931 A 20071221

Priority

  • JP 2007074651 W 20071221
  • JP 2006350440 A 20061226

Abstract (en)

[origin: EP2096473A1] To provide an electrical and optical hybrid board that has on one surface an optical waveguide and on the other surface an electrical interconnect pattern or the like, in which the core pattern and electrical interconnect pattern or the like are positioned in place with high accuracy, and a method of manufacturing the same. The method includes: preparing laminate 4 of core layer 21 and clad layer 20 on an electrical wiring board; forming alignment mark 12 and electrical interconnect pattern 13 or electrical joint at the same time on a surface of the electrical wiring board opposite to a surface where laminate 4 is formed, alignment mark 12 used for forming a core pattern of optical waveguide, the electrical joint used for connection with an external device; and forming a core pattern of optical waveguide on the basis of alignment mark 12 without using a photomask.

IPC 8 full level

G02B 6/13 (2006.01); G02B 6/132 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01)

CPC (source: EP KR US)

G02B 6/122 (2013.01 - KR); G02B 6/13 (2013.01 - KR); G02B 6/132 (2013.01 - EP US); H05K 1/02 (2013.01 - KR); H05K 1/0274 (2013.01 - EP US); H05K 3/46 (2013.01 - KR); H05K 1/0269 (2013.01 - EP US); H05K 3/0008 (2013.01 - EP US); H05K 3/0032 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); H05K 2201/09781 (2013.01 - EP US); H05K 2201/0989 (2013.01 - EP US); H05K 2201/09918 (2013.01 - EP US); H05K 2201/10106 (2013.01 - EP US); Y10T 29/49124 (2015.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2096473 A1 20090902; EP 2096473 A4 20100721; EP 2096473 B1 20120808; CN 101568867 A 20091028; CN 101568867 B 20110420; JP 5512131 B2 20140604; JP WO2008078680 A1 20100422; KR 101084407 B1 20111118; KR 20090049618 A 20090518; US 2010065309 A1 20100318; US 8175424 B2 20120508; WO 2008078680 A1 20080703

DOCDB simple family (application)

EP 07859931 A 20071221; CN 200780047936 A 20071221; JP 2007074651 W 20071221; JP 2008551080 A 20071221; KR 20097006610 A 20071221; US 51621407 A 20071221