EP 2098304 A3 20091209 - Method for sealing a structural panel
Title (en)
Method for sealing a structural panel
Title (de)
Verfahren zum Versiegeln einer Bauplatte aus Holz oder einem Holzwerkstoff
Title (fr)
Procédé de scellement d'une plaque de construction
Publication
Application
Priority
- EP 04020746 A 20040901
- DE 10341172 A 20030906
Abstract (en)
[origin: EP2098304A2] The method involves applying a liquid resin i.e. melamine resin, on a top side of a construction plate that is made of wood or wood material. The resin is dried, and the plate is pressed under the influence of temperature so that the resin partially melts. The resin is applied in multiple layers and each layer is dried before the next is applied. The resin is stained. A color layer is applied on the top side or on a bottom side under or between the resin layers. Corundum is mixed into or scattered onto the resin layer. The sealing is performed simultaneously on the top and the bottom sides.
IPC 8 full level
B05D 7/06 (2006.01); B05D 3/02 (2006.01); B05D 3/12 (2006.01); B27M 3/04 (2006.01); B27N 7/00 (2006.01); E04F 13/10 (2006.01); E04F 15/04 (2006.01); E04G 9/04 (2006.01); B05D 1/40 (2006.01)
CPC (source: EP US)
B05D 3/0254 (2013.01 - EP US); B05D 3/12 (2013.01 - EP US); B05D 7/06 (2013.01 - EP US); B27M 3/04 (2013.01 - EP US); B05D 1/40 (2013.01 - EP US); B05D 2252/10 (2013.01 - EP US); B05D 2601/20 (2013.01 - EP US); E04F 15/02 (2013.01 - EP US)
Citation (search report)
- [A] US 6165308 A 20001226 - CHEN FRANK [US], et al & EP 1568489 A1 20050831 - VALSPAR SOURCING INC [US]
- [PA] DE 10245914 A1 20040415 - HW IND GMBH & CO KG [DE]
- [A] CH 414524 A 19660615 - ROGERS CORP [US]
- [L] EP 1512468 A2 20050309 - KRONOTEC AG [CH]
- [E] EP 1454763 A2 20040908 - KRONOTEC AG [CH]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1512468 A2 20050309; EP 1512468 A3 20060405; EP 1512468 B1 20091007; AT E444815 T1 20091015; DE 10341172 A1 20050407; DE 10341172 B4 20090723; DE 10362218 B4 20100916; DE 502004010191 D1 20091119; EP 2098304 A2 20090909; EP 2098304 A3 20091209; EP 2098304 B1 20130227; ES 2331796 T3 20100115; PL 1512468 T3 20100331; PL 2098304 T3 20130830; US 2005089644 A1 20050428; US 8003168 B2 20110823
DOCDB simple family (application)
EP 04020746 A 20040901; AT 04020746 T 20040901; DE 10341172 A 20030906; DE 10362218 A 20030906; DE 502004010191 T 20040901; EP 09007035 A 20040901; ES 04020746 T 20040901; PL 04020746 T 20040901; PL 09007035 T 20040901; US 93233704 A 20040902