EP 2099954 A1 20090916 - DEVICE AND METHOD FOR ELECTROPLATING
Title (en)
DEVICE AND METHOD FOR ELECTROPLATING
Title (de)
VORRICHTUNG UND VERFAHREN ZUR GALVANISCHEN BESCHICHTUNG
Title (fr)
DISPOSITIF ET PROCÉDÉ DE REVÊTEMENT PAR ÉLECTROLYSE
Publication
Application
Priority
- EP 2007062805 W 20071126
- EP 06124862 A 20061128
- EP 07847339 A 20071126
Abstract (en)
[origin: WO2008065069A1] The invention relates to a device for the electroplating of a surface of a substrate (7) with a structured or fully flat base layer (9), which device comprises at least one electrolytic bath (3) with at least one rotatably mounted roller (2) which can be connected as a cathode and, during the electroplating, contacts the base layer (9), wherein the base layer (9) is covered by an electrolyte solution (5) contained in the electrolytic bath (3) and is moved in relation to the at least one roller (2) during the coating. The at least one roller (2) which can be connected as a cathode is cathodically connected during the contact with the base layer (9) and becomes currentless or anodically connected as soon as there is no contact with the base layer (9). The invention also relates to a method for the electroplating of a surface of a substrate (7) with a structured or fully flat base layer (9), wherein the base layer (9) is surrounded by an electrolyte solution (5) and is contacted by at least one roller (2) which can be connected as a cathode. The roller (2) which can be connected as a cathode is cathodically connected when it contacts the base layer (9) and becomes currentless or is anodically connected as soon as there is no contact with the base layer (9).
IPC 8 full level
C25D 7/06 (2006.01); C25D 17/28 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP KR US)
C25D 7/06 (2013.01 - KR); C25D 7/0614 (2013.01 - EP US); C25D 17/28 (2013.01 - EP KR US); H05K 3/24 (2013.01 - KR); H05K 3/241 (2013.01 - EP US); H05K 2203/0143 (2013.01 - EP US); H05K 2203/1509 (2013.01 - EP US)
Citation (search report)
See references of WO 2008065069A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008065069 A1 20080605; BR PI0719665 A2 20131217; CN 101542022 A 20090923; EP 2099954 A1 20090916; IL 198594 A0 20100217; JP 2010511103 A 20100408; KR 20090083489 A 20090803; RU 2009124293 A 20110110; TW 200829726 A 20080716; US 2009301891 A1 20091210
DOCDB simple family (application)
EP 2007062805 W 20071126; BR PI0719665 A 20071126; CN 200780043998 A 20071126; EP 07847339 A 20071126; IL 19859409 A 20090506; JP 2009538691 A 20071126; KR 20097013503 A 20071126; RU 2009124293 A 20071126; TW 96139950 A 20071024; US 51528907 A 20071126