EP 2100327 A1 20090916 - ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION
Title (en)
ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION
Title (de)
ELEKTRONISCHE, INSBESONDERE MIKROELEKTRONISCHE FUNKTIONSGRUPPE UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
GROUPE FONCTIONNEL ÉLECTRONIQUE, EN PARTICULIER MICROÉLECTRONIQUE, ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
EP 2006011515 W 20061124
Abstract (en)
[origin: WO2008061554A1] The invention relates to an electronic, in particular microelectronic, functional group and to a method for its production. The method according to the invention includes the following steps: a) coating of a mount (5a) with a non-conductive adhesive (4a); b) application of a conductor structure (3) to a subarea of the adhesive layer (4a); c) arrangement of an electronic component (1) with at least one external electrical connecting contact (2) on the adhesive layer (4a) and on the conductor structure (3), with the at least one connecting contact (2) of the electronic component (1) being brought directly into contact with the conductor structure (3), and with a part of the outer casing of the component (1) being brought directly into contact with the adhesive layer (4a). The method according to the invention allows electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.
IPC 8 full level
H01L 21/60 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 23/49855 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H05K 3/326 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/81191 (2013.01 - EP US); H01L 2224/81205 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/07811 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H05K 3/12 (2013.01 - EP US); H05K 3/386 (2013.01 - EP US); H05K 2201/091 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2203/0278 (2013.01 - EP US); Y10T 156/10 (2015.01 - EP US)
Citation (search report)
See references of WO 2008061554A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008061554 A1 20080529; CN 101563765 A 20091021; CN 101563765 B 20130925; EP 2100327 A1 20090916; JP 2010510678 A 20100402; JP 5248518 B2 20130731; NO 20091913 L 20090624; US 2010142167 A1 20100610
DOCDB simple family (application)
EP 2006011515 W 20061124; CN 200680056458 A 20061124; EP 06829212 A 20061124; JP 2009537486 A 20061124; NO 20091913 A 20090515; US 51580410 A 20100119