EP 2100331 A1 20090916 - ELECTRONIC COMPONENT MODULE AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
ELECTRONIC COMPONENT MODULE AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
ELEKTRONISCHES BAUELEMENTMODUL UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
MODULE DE COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
EP 2006069126 W 20061130
Abstract (en)
[origin: WO2008064718A1] The invention relates to an electronic component module with at least one multi-layer ceramic circuit carrier (2, 3) and at least one cooling device comprising at least one cooling body (4). A composite layer (5, 6) is arranged at least in some regions between the ceramic circuit carrier (2, 3) and the cooling device (4). Said composite layer is designed for a reactive connection with the ceramic circuit carrier (2, 3) during a primary process and for connection with the cooling device (4). The invention also relates to a method for the production of said electronic component module.
IPC 8 full level
H01L 23/34 (2006.01)
CPC (source: EP KR US)
H01L 21/4807 (2013.01 - EP US); H01L 23/142 (2013.01 - EP US); H01L 23/36 (2013.01 - KR); H01L 23/3735 (2013.01 - EP US); H01L 23/48 (2013.01 - KR); H05K 3/0061 (2013.01 - EP US); H05K 3/38 (2013.01 - EP US); B82Y 30/00 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 3/4611 (2013.01 - EP US); H05K 3/4629 (2013.01 - EP US); H05K 2201/0175 (2013.01 - EP US); Y10T 29/49117 (2015.01 - EP US)
Citation (search report)
See references of WO 2008064718A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008064718 A1 20080605; EP 2100331 A1 20090916; JP 2010511297 A 20100408; KR 20090087106 A 20090814; US 2010089620 A1 20100415
DOCDB simple family (application)
EP 2006069126 W 20061130; EP 06830230 A 20061130; JP 2009538594 A 20061130; KR 20097013690 A 20061130; US 51716809 A 20090601