Global Patent Index - EP 2100783 B8

EP 2100783 B8 20180207 - Rain sensor embedded on printed circuit board

Title (en)

Rain sensor embedded on printed circuit board

Title (de)

Regensensor, der auf einer Leiterplatte montiert ist

Title (fr)

Capteur de pluie intégré sur une carte à circuit imprimé

Publication

EP 2100783 B8 20180207 (EN)

Application

EP 09155248 A 20090316

Priority

US 7623908 A 20080314

Abstract (en)

[origin: US2008222827A1] A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

IPC 8 full level

B60S 1/08 (2006.01); B32B 17/10 (2006.01); G01D 5/24 (2006.01); G01N 21/25 (2006.01); H05K 1/02 (2006.01)

CPC (source: EP)

B32B 17/10036 (2013.01); B32B 17/10174 (2013.01); B32B 17/10293 (2013.01); B32B 17/10761 (2013.01); B32B 17/10788 (2013.01); B60S 1/0822 (2013.01); B60S 1/0825 (2013.01); G01D 5/2405 (2013.01); H05K 1/0218 (2013.01); H05K 1/162 (2013.01); B60S 1/087 (2013.01); H05K 1/0219 (2013.01); H05K 1/0298 (2013.01); H05K 1/189 (2013.01); H05K 3/0058 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09663 (2013.01)

Designated contracting state (EPC)

DE ES FR GB IT PL

DOCDB simple family (publication)

US 2008222827 A1 20080918; US 7830267 B2 20101109; EP 2100783 A2 20090916; EP 2100783 A3 20110518; EP 2100783 B1 20171220; EP 2100783 B8 20180207

DOCDB simple family (application)

US 7623908 A 20080314; EP 09155248 A 20090316