Global Patent Index - EP 2105935 A1

EP 2105935 A1 20090930 - Plated flat conductor and flexible flat cable therewith

Title (en)

Plated flat conductor and flexible flat cable therewith

Title (de)

Plattierter Flachleiter und flexibles Flachkabel damit

Title (fr)

Conducteur plat plaqué et câble plat flexible associé

Publication

EP 2105935 A1 20090930 (EN)

Application

EP 09004117 A 20090323

Priority

JP 2008075365 A 20080324

Abstract (en)

Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu 3 Sn disposed on the surface of the flat conductor, a second intermetallic compound layer of Cu 6 Sn 5 formed on the first intermetallic compound, and a superficial layer formed on the second intermetallic compound layer. The superficial layer is plating material of pure tin or a tin alloy and has an average thickness from about 0.3µm to 1.0µm and a maximum thickness of about 1.0µm or less. A volume ratio of the second intermetallic compound layer to the first intermetallic compound layer is about 1.5 or more.

IPC 8 full level

H01B 1/02 (2006.01)

CPC (source: EP KR US)

H01B 1/026 (2013.01 - EP KR US); H01B 7/04 (2013.01 - KR); H01B 7/0838 (2013.01 - KR); H01B 13/0016 (2013.01 - KR); Y10T 428/12715 (2015.01 - EP US)

Citation (applicant)

US 2742687 A 19560424 - RUEMMLER WALDEMAR P

Citation (search report)

Designated contracting state (EPC)

DE FR GB IT

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2105935 A1 20090930; EP 2105935 B1 20110323; CN 101546619 A 20090930; CN 101546619 B 20121107; DE 602009000930 D1 20110505; HK 1137845 A1 20100806; JP 2009231065 A 20091008; KR 101044324 B1 20110629; KR 20090101833 A 20090929; TW 200945376 A 20091101; TW I374456 B 20121011; US 2009236123 A1 20090924; US 7999187 B2 20110816

DOCDB simple family (application)

EP 09004117 A 20090323; CN 200910130202 A 20090324; DE 602009000930 T 20090323; HK 10101855 A 20100222; JP 2008075365 A 20080324; KR 20090023748 A 20090320; TW 98109374 A 20090323; US 40935009 A 20090323