Global Patent Index - EP 2110056 B1

EP 2110056 B1 20140611 - Compound assembly

Title (en)

Compound assembly

Title (de)

Verbundanordnung

Title (fr)

Agencement composite

Publication

EP 2110056 B1 20140611 (DE)

Application

EP 09005037 A 20090406

Priority

DE 202008005450 U 20080418

Abstract (en)

[origin: EP2110056A1] Composite arrangement comprises a first composite component (11) formed as a flat layer and a further composite component (13) formed as a further layer on one side of the first composite component to form a support surface (33). The further composite component has an exchange module element (32) which forms a partial region of the further composite component. Preferred Features: A base module element (31) of the further composite component is connected to the first composite component. The exchange module element can be exchanged.

IPC 8 full level

A47C 27/15 (2006.01); B32B 3/28 (2006.01)

CPC (source: EP)

B32B 3/28 (2013.01); B32B 7/00 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 202008005450 U1 20080828; EP 2110056 A1 20091021; EP 2110056 B1 20140611

DOCDB simple family (application)

DE 202008005450 U 20080418; EP 09005037 A 20090406