EP 2110401 B1 20120926 - Addition-curable silicone composition and cured product thereof
Title (en)
Addition-curable silicone composition and cured product thereof
Title (de)
Additionsvernetzende Silikonzusammensetzung und gehärtetes Produkt daraus
Title (fr)
Composition d'addition de silicone durcissable et produit durci correspondant
Publication
Application
Priority
JP 2008105522 A 20080415
Abstract (en)
[origin: EP2110401A1] An addition-curable silicone composition is provided. The composition includes (A) a resin structure organopolysiloxane and (B) a platinum group metal-based catalyst. The component (A) has silicon-bonded alkenyl groups and hydrosilyl groups, and includes a structure in which R 2 2 SiO units, wherein R 2 is a methyl group, etc., are connected together in a continuous repeating sequence, and the number of units in the continuous repeating sequence is within a range from 5 to 300. The composition can be prepared in a solid or semisolid form, and hence is suitable conventional molding apparatus such as a transfer molding apparatus, and upon curing, forms a hard resin cured product that exhibits excellent flexibility and minimal surface tack.
IPC 8 full level
C08G 77/20 (2006.01); C08L 83/04 (2006.01); H01L 23/29 (2006.01); H01L 31/0203 (2006.01)
CPC (source: EP KR US)
C08G 77/12 (2013.01 - KR); C08G 77/16 (2013.01 - KR); C08G 77/20 (2013.01 - EP KR US); C08G 77/70 (2013.01 - KR); C08L 83/04 (2013.01 - EP KR US); H01L 23/296 (2013.01 - EP KR US); C08G 77/12 (2013.01 - EP US); C08G 77/16 (2013.01 - EP US); C08G 77/70 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP KR US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2110401 A1 20091021; EP 2110401 B1 20120926; CN 101575453 A 20091111; CN 101575453 B 20121010; JP 2009275214 A 20091126; JP 5201063 B2 20130605; KR 101508394 B1 20150406; KR 20090109488 A 20091020; TW 200948901 A 20091201; TW I447175 B 20140801; US 2009259002 A1 20091015; US 8071707 B2 20111206
DOCDB simple family (application)
EP 09251085 A 20090414; CN 200910141979 A 20090414; JP 2009094531 A 20090409; KR 20090032133 A 20090414; TW 98112265 A 20090414; US 42331509 A 20090414