Global Patent Index - EP 2113393 A1

EP 2113393 A1 20091104 - Floor panel, method for manufacturing floor panels and transfer foil

Title (en)

Floor panel, method for manufacturing floor panels and transfer foil

Title (de)

Bodenpaneel, Verfahren zur Herstellung von Bodenpaneelen und Transferfolie

Title (fr)

Panneau de plancher, procédé de fabrication des panneaux de plancher et film de transfert

Publication

EP 2113393 A1 20091104 (EN)

Application

EP 08008164 A 20080429

Priority

EP 08008164 A 20080429

Abstract (en)

Floor panel, wherein this floor panel (1) at one or more edges (2-3), next to the upper side (9), is provided with a chamfer (6), wherein the surface (7) of said chamfer (6) is provided with a decorative covering (8), characterized in that said decorative covering (8) comprises at least a first decorative layer (22) and a second decorative layer (23), which decorative layers (22-23) are provided on top of each other, wherein the first decorative layer (22) remains at least partially visible through the second decorative layer (23) provided on top thereof.

IPC 8 full level

B44C 3/02 (2006.01); B44F 9/02 (2006.01)

CPC (source: EP)

B44C 1/1712 (2013.01); B44C 5/04 (2013.01); B44F 9/02 (2013.01)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 2113393 A1 20091104; EP 2113393 B1 20120411; AT E552990 T1 20120415; WO 2009133486 A1 20091105

DOCDB simple family (application)

EP 08008164 A 20080429; AT 08008164 T 20080429; IB 2009051477 W 20090408