Global Patent Index - EP 2117744 A1

EP 2117744 A1 20091118 - METHOD AND MOULD ARRANGEMENT FOR EXPLOSION FORMING

Title (en)

METHOD AND MOULD ARRANGEMENT FOR EXPLOSION FORMING

Title (de)

VERFAHREN UND WERKZEUGANORDNUNG ZUM EXPLOSIONSUMFORMEN

Title (fr)

PROCÉDÉ ET AGENCEMENT D'OUTILS POUR FORMAGE PAR EXPLOSION

Publication

EP 2117744 A1 20091118 (DE)

Application

EP 07856709 A 20071213

Priority

  • EP 2007010966 W 20071213
  • DE 102007007330 A 20070214

Abstract (en)

[origin: CA2680322A1] The invention is intended to improve a mould arrangement (1) and a method for the explosion forming of a workpiece (12) by means of gas explosion, in which the workpiece is arranged in a receiving space (15) of a forming moul d (2), the receiving space being filled at least partially with liquid (26) and the explosion being triggered by igniting an explosive gas mixture (23), to the extent that the mould arrangement and the method are simplified and suitable for mass production. This object is achieved by a mould arrangement and a method for the explosion forming of a workpiece by means of gas explo sion in which the workpiece is arranged in a receiving space of a forming mo uld (2), wherein the receiving space is at least partially filled with liqui d and the explosion is triggered by igniting an explosive gas mixture in whi ch the exposive gas mixture is at least partially provided over the surface of the liquid (22) before the ignition.

IPC 8 full level

B21D 26/08 (2006.01)

CPC (source: EP KR US)

B21D 26/08 (2013.01 - EP KR US); Y10S 72/706 (2013.01 - EP US)

Citation (search report)

See references of WO 2008098608A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 102007007330 A1 20080821; AU 2007346789 A1 20080821; AU 2007346789 A2 20100128; CA 2680322 A1 20080821; CN 101622085 A 20100106; CN 101622085 B 20151014; EA 016721 B1 20120730; EA 200901069 A1 20100630; EP 2117744 A1 20091118; EP 2117744 B1 20180926; JP 2010517791 A 20100527; JP 5583412 B2 20140903; KR 20090122442 A 20091130; MX 2009008694 A 20091102; US 2010206034 A1 20100819; US 8875553 B2 20141104; WO 2008098608 A1 20080821

DOCDB simple family (application)

DE 102007007330 A 20070214; AU 2007346789 A 20071213; CA 2680322 A 20071213; CN 200780051389 A 20071213; EA 200901069 A 20071213; EP 07856709 A 20071213; EP 2007010966 W 20071213; JP 2009549782 A 20071213; KR 20097019011 A 20071213; MX 2009008694 A 20071213; US 44772707 A 20071213