EP 2117766 A1 20091118 - SOLDER ALLOYS AND METHOD FOR THE REPAIR OF A COMPONENT
Title (en)
SOLDER ALLOYS AND METHOD FOR THE REPAIR OF A COMPONENT
Title (de)
LOTLEGIERUNGEN UND VERFAHREN ZUR REPARATUR EINES BAUTEILS
Title (fr)
ALLIAGES DE BRASAGE ET DISPOSITIF POUR LA RÉPARATION D'UN ÉLÉMENT DE CONSTRUCTION
Publication
Application
Priority
- EP 2008052324 W 20080226
- EP 07005303 A 20070314
- EP 07007925 A 20070418
- EP 07011676 A 20070614
- EP 08709220 A 20080226
Abstract (en)
[origin: WO2008110454A1] Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The solder alloy comprises gallium and/or germanium, preferably forming the Y' phase and having improved mechanical properties.
IPC 8 full level
B23K 35/30 (2006.01); B23K 1/00 (2006.01); C22C 19/00 (2006.01)
CPC (source: EP KR US)
B23K 1/00 (2013.01 - KR); B23K 35/30 (2013.01 - KR); B23K 35/3033 (2013.01 - EP US); C22C 19/00 (2013.01 - KR); C22C 19/007 (2013.01 - EP US); B23K 2101/001 (2018.07 - EP US)
Citation (search report)
See references of WO 2008110454A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008110454 A1 20080918; EP 2117766 A1 20091118; JP 2010520814 A 20100617; JP 5780703 B2 20150916; KR 101301232 B1 20130828; KR 20100034729 A 20100401; KR 20120059653 A 20120608; US 2010025454 A1 20100204; US 8613885 B2 20131224
DOCDB simple family (application)
EP 2008052324 W 20080226; EP 08709220 A 20080226; JP 2009553099 A 20080226; KR 20097021415 A 20080226; KR 20127012811 A 20080226; US 53118908 A 20080226