EP 2119328 A1 20091118 - NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR
Title (en)
NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR
Title (de)
HAFTVERHINDERUNGSMATERIAL, VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINER FLÄCHIGEN MATERIALSCHICHT SOWIE MEHRLAGIGE STRUKTUR UND VERWENDUNG HIERFÜR
Title (fr)
MATIERE INHIBITRICE D'ADHERENCE, PROCEDE POUR ENLEVER UNE PORTION D'UNE COUCHE DE MATIERE PLANE, STRUCTURE MULTICOUCHE ET LEUR UTILISATION.
Publication
Application
Priority
- AT 2008000029 W 20080130
- AT 1002007 U 20070216
- AT 7272007 U 20071203
Abstract (en)
[origin: WO2008098271A1] The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
IPC 8 full level
CPC (source: EP KR US)
B32B 37/26 (2013.01 - US); C08L 91/06 (2013.01 - US); C09D 5/20 (2013.01 - KR); H05K 1/02 (2013.01 - KR); H05K 3/46 (2013.01 - KR); H05K 3/4691 (2013.01 - EP US); H05K 1/183 (2013.01 - EP US); H05K 3/4652 (2013.01 - EP US); H05K 2201/09127 (2013.01 - EP US); Y10T 156/1064 (2015.01 - EP US); Y10T 156/1153 (2015.01 - EP US); Y10T 156/1195 (2015.01 - EP US); Y10T 428/24802 (2015.01 - EP US); Y10T 428/265 (2015.01 - EP US)
Citation (search report)
See references of WO 2008098271A1
Citation (examination)
JP H1022645 A 19980123 - NIPPON AVIONICS CO LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008098271 A1 20080821; AT 11663 U1 20110215; EP 2119328 A1 20091118; JP 2010518648 A 20100527; KR 20090128384 A 20091215; TW 200850106 A 20081216; US 2010009178 A1 20100114; US 2013149506 A1 20130613; US 2018257364 A1 20180913; US 8388792 B2 20130305
DOCDB simple family (application)
AT 2008000029 W 20080130; AT 7272007 U 20071203; EP 08700295 A 20080130; JP 2009549742 A 20080130; KR 20097016794 A 20080130; TW 97104146 A 20080204; US 201313759645 A 20130205; US 201815980864 A 20180516; US 44960608 A 20080130