Global Patent Index - EP 2119509 A2

EP 2119509 A2 20091118 - Compact head for the application of hot melt adhesive

Title (en)

Compact head for the application of hot melt adhesive

Title (de)

Kompakter Kopf zum Aufbringen von Heißklebstoff

Title (fr)

Tête compacte pour l'application de colles thermofusibles

Publication

EP 2119509 A2 20091118 (FR)

Application

EP 09159904 A 20090511

Priority

ES 200801391 A 20080514

Abstract (en)

The head has an adhesive melting reservoir (1) including, in its base, a series of passage outlets (5) communicating with a lower chamber (6), which communicates with an application head (2) i.e. nozzle, through a duct (7). The reservoir is connected to the application head, and surrounded by electrical resistors (8) housed in a peripheral chamber (4) filled with an insulating material. The reservoir is realized with a tight seal to avoid influence of external air on the adhesive, and surrounded by an insulating layer to prevent heat loss at outside.

Abstract (fr)

Tête compacte pour l'application de colles thermofusibles, comprenant un réservoir de fusion (1) et une tête (2) d'application, raccordés directement l'un à l'autre, le réservoir de fusion (1) comportant des sorties inférieures (5) qui communiquent avec une chambre (6), laquelle communique à son tour avec la tête (2) d'application.

IPC 8 full level

B05C 5/04 (2006.01); B05C 11/10 (2006.01)

CPC (source: EP ES)

B05C 11/1042 (2013.01 - EP ES)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2119509 A2 20091118; EP 2119509 A3 20100217; ES 2356758 A1 20110413; ES 2356758 B1 20120125

DOCDB simple family (application)

EP 09159904 A 20090511; ES 200801391 A 20080514