EP 2119509 A3 20100217 - Compact head for the application of hot melt adhesive
Title (en)
Compact head for the application of hot melt adhesive
Title (de)
Kompakter Kopf zum Aufbringen von Heißklebstoff
Title (fr)
Tête compacte pour l'application de colles thermofusibles
Publication
Application
Priority
ES 200801391 A 20080514
Abstract (en)
[origin: EP2119509A2] The head has an adhesive melting reservoir (1) including, in its base, a series of passage outlets (5) communicating with a lower chamber (6), which communicates with an application head (2) i.e. nozzle, through a duct (7). The reservoir is connected to the application head, and surrounded by electrical resistors (8) housed in a peripheral chamber (4) filled with an insulating material. The reservoir is realized with a tight seal to avoid influence of external air on the adhesive, and surrounded by an insulating layer to prevent heat loss at outside.
IPC 8 full level
B05C 5/04 (2006.01); B05C 11/10 (2006.01)
CPC (source: EP ES)
B05C 11/1042 (2013.01 - EP ES)
Citation (search report)
- [X] DE 3815089 A1 19891109 - HESSELMANN PLANATOLWERK H [DE]
- [X] EP 1447143 A2 20040818 - ROBATECH AG [CH]
- [X] EP 1894689 A1 20080305 - SCM GROUP SPA [IT]
- [X] DE 20203827 U1 20020725 - PAUL OTT GMBH LAMBACH [AT]
- [X] FR 2510431 A1 19830204 - NORDSON CORP [US]
- [X] US 5814790 A 19980929 - BONDESON BENJAMIN J [US], et al
- [A] US 2567960 A 19510918 - MYERS WILLIAM R, et al
- [A] DE 2336454 A1 19750206 - WEHRMANN GUENTER
- [A] EP 1260330 A2 20021127 - SCM GROUP SPA [IT]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2119509 A2 20091118; EP 2119509 A3 20100217; ES 2356758 A1 20110413; ES 2356758 B1 20120125
DOCDB simple family (application)
EP 09159904 A 20090511; ES 200801391 A 20080514