Global Patent Index - EP 2121070 A2

EP 2121070 A2 20091125 - IMPLANTABLE DEVICE WITH RESERVOIRS FOR INCREASED DRUG LOADING

Title (en)

IMPLANTABLE DEVICE WITH RESERVOIRS FOR INCREASED DRUG LOADING

Title (de)

IMPLANTIERBARE VORRICHTUNG MIT BEHÄLTERN ZUR AUFNAHME HÖHERER MEDIKAMENTENMENGEN

Title (fr)

DISPOSITIF IMPLANTABLE À RÉSERVOIRS PERMETTANT D'AUGMENTER LA CHARGE MÉDICAMENTEUSE

Publication

EP 2121070 A2 20091125 (EN)

Application

EP 08728474 A 20080129

Priority

  • US 2008052322 W 20080129
  • US 66890707 A 20070130

Abstract (en)

[origin: US2008183281A1] A method of manufacturing a drug loaded stent includes applying a photo resistant coating to at least a portion of a stent framework and removing at least a portion of the photo resistant coating from the stent framework. The method further includes applying an etchant to at least a portion of the stent framework and forming a plurality undercut drug reservoirs in the stent framework based on applying the etchant. A stent for treating a vascular condition includes a stent framework, a plurality of undercut reservoirs formed within the stent framework and a therapeutic agent disposed within at least a portion of the plurality of undercut reservoirs.

IPC 8 full level

A61L 31/10 (2006.01); A61F 2/06 (2006.01); A61L 31/16 (2006.01)

CPC (source: EP US)

A61L 31/146 (2013.01 - EP US); A61L 31/16 (2013.01 - EP US); A61P 7/02 (2017.12 - EP); A61P 9/00 (2017.12 - EP); A61P 9/10 (2017.12 - EP); A61F 2/91 (2013.01 - EP US); A61F 2250/0068 (2013.01 - EP US); A61L 2300/61 (2013.01 - EP US); A61L 2400/18 (2013.01 - EP US); Y10S 623/901 (2013.01 - EP)

Citation (search report)

See references of WO 2008094915A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2008183281 A1 20080731; US 7575593 B2 20090818; EP 2121070 A2 20091125; JP 2010516434 A 20100520; WO 2008094915 A2 20080807; WO 2008094915 A3 20090709

DOCDB simple family (application)

US 66890707 A 20070130; EP 08728474 A 20080129; JP 2009548392 A 20080129; US 2008052322 W 20080129