Global Patent Index - EP 2121867 A1

EP 2121867 A1 20091125 - PEROXIDE-CURABLE SILICONE-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ADHESIVE TAPE

Title (en)

PEROXIDE-CURABLE SILICONE-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ADHESIVE TAPE

Title (de)

PEROXID-HÄRTBARE, SILICONBASIERTE, DRUCKEMPFINDLICHE KLEBSTOFFZUSAMMENSETZUNG UND KLEBEBAND

Title (fr)

COMPOSITION ADHÉSIVE SENSIBLE À LA PRESSION À BASE DE SILICONE DURCISSABLE PAR PEROXYDE ET RUBAN ADHÉSIF

Publication

EP 2121867 A1 20091125 (EN)

Application

EP 07851128 A 20071220

Priority

  • JP 2007075334 W 20071220
  • JP 2006347679 A 20061225

Abstract (en)

[origin: WO2008081951A1] A peroxide-curable silicone-based pressure-sensitive adhesive composition comprising (A) a diorganopolysiloxane having silicon-bonded alkenyl groups at both molecular terminals used in amount of 100 parts by weight; (B) an organopolysiloxane resin having one or more silanol(OH) groups in one molecule and consisting of R<SUP>3</SUP> <SUB>2</SUB>(

IPC 8 full level

C09J 183/04 (2006.01)

CPC (source: EP KR US)

C08L 83/00 (2013.01 - EP KR US); C09J 7/381 (2017.12 - KR); C09J 183/04 (2013.01 - EP KR US); C08G 77/20 (2013.01 - EP US); C09J 2483/00 (2013.01 - KR); Y10T 428/2852 (2015.01 - EP US)

Citation (search report)

See references of WO 2008081951A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2008081951 A1 20080710; CN 101558128 A 20091014; CN 101558128 B 20130102; EP 2121867 A1 20091125; EP 2121867 B1 20130828; JP 2008156496 A 20080710; JP 5049584 B2 20121017; KR 101460548 B1 20141112; KR 20090101364 A 20090925; TW 200900479 A 20090101; TW I447197 B 20140801; US 2010104865 A1 20100429

DOCDB simple family (application)

JP 2007075334 W 20071220; CN 200780045728 A 20071220; EP 07851128 A 20071220; JP 2006347679 A 20061225; KR 20097015706 A 20071220; TW 96149973 A 20071225; US 52061107 A 20071220