Global Patent Index - EP 2122792 A1

EP 2122792 A1 20091125 - METHOD FOR PRODUCING A COMPONENT AND COMPONENT

Title (en)

METHOD FOR PRODUCING A COMPONENT AND COMPONENT

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES BAUTEILS SOWIE BAUTEIL

Title (fr)

PROCEDE DE REALISATION D'UN COMPOSANT ET COMPOSANT CORRESPONDANT

Publication

EP 2122792 A1 20091125 (DE)

Application

EP 08716879 A 20080215

Priority

  • EP 2008051873 W 20080215
  • EP 07102450 A 20070215
  • EP 08716879 A 20080215

Abstract (en)

[origin: WO2008099009A1] The invention relates to a method for producing a component, comprising an inlay piece (1), enclosed by a plastic layer, wherein, in a first step, at least a part of the inlay piece (1) is coated with a plastic moulding mass (2) of low viscosity and in a second step, the inlay piece with the coating is injection moulded with a synthetic resin component (3), or the inlay piece (1) is coated with a synthetic resin component (3), wherein regions of the inlay piece (1) are not coated and the non-coated regions are cast with a plastic moulding mass (2) of low viscosity. The invention further relates to a component, an inlay piece (1) and a plastic coating made up of at least two plastic components,wherein the first plastic component, which at least partly directly coats the inlay piece (1), is a plastic moulding mass (2) of low viscosity and the second plastic component is a plastic resin component (3).

IPC 8 full level

H02G 3/08 (2006.01); H02G 3/22 (2006.01); H02G 15/013 (2006.01)

CPC (source: EP KR US)

B29C 45/14 (2013.01 - KR); H02G 3/088 (2013.01 - EP US); H02G 3/22 (2013.01 - EP US); H02G 15/013 (2013.01 - EP KR US); Y10T 428/12493 (2015.01 - EP US); Y10T 428/29 (2015.01 - EP US)

Citation (search report)

See references of WO 2008099009A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2008099009 A1 20080821; BR PI0808086 A2 20140722; CN 101652911 A 20100217; EP 2122792 A1 20091125; JP 2010517834 A 20100527; KR 20100014400 A 20100210; US 2010009213 A1 20100114

DOCDB simple family (application)

EP 2008051873 W 20080215; BR PI0808086 A 20080215; CN 200880008385 A 20080215; EP 08716879 A 20080215; JP 2009549835 A 20080215; KR 20097019184 A 20080215; US 52749608 A 20080215