EP 2125281 A1 20091202 - METHOD FOR THE REFRACTORY ASSEMBLY OF A CARBON MATERIAL AND A COPPER ALLOY
Title (en)
METHOD FOR THE REFRACTORY ASSEMBLY OF A CARBON MATERIAL AND A COPPER ALLOY
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES FEUERFESTEN KOHLENSTOFFMATERIALS UND EINER KUPFERLEGIERUNG
Title (fr)
PROCÉDÉ D'ASSEMBLAGE RÉFRACTAIRE ENTRE UN MATERIAU CARBONE ET UN ALLIAGE DE CUIVRE
Publication
Application
Priority
- FR 2008000198 W 20080214
- FR 0701156 A 20070216
Abstract (en)
[origin: FR2912675A1] The use of an alloy (I) based on copper (Cu) and silicon (Si), containing (atomic basis) 25-60% Cu, 40-75% Si and at least 95% Cu plus Si (preferably 60% Cu and 40% Si), is claimed for bonding porous carbon workpiece(s) to copper-rich metallic workpiece(s). Independent claims are included for: (1) a soldering paste (A), comprising a mixture of powdered (I) and an inorganic binder; (2) a method for bonding a porous carbon workpiece to a copper-rich metallic workpiece, involving (a) depositing (I) or (A) on the carbon workpiece in an amount (as (I)) of 50-500 mg/cm 2>, (b) heating under vacuum or an inert atmosphere to melt (I) or (A), (c) contacting the asssembly with the other workpiece and (d) heating the assembly under vacuum or an inert atmosphere at a temperature below the m.pts. of the copper workpiece and (I) or (A); (3) an assembly consisting of the porous carbon and copper-rich workpieces, bonded at their interface by a fused and solidified layer of (I); and (4) a device comprising at least one of the assemblies.
IPC 8 full level
B23K 35/02 (2006.01); B23K 9/173 (2006.01); B23K 35/30 (2006.01); C04B 37/00 (2006.01)
CPC (source: EP US)
B23K 35/0244 (2013.01 - EP US); B23K 35/302 (2013.01 - EP US); C04B 37/026 (2013.01 - EP US); C22C 9/10 (2013.01 - EP US); C04B 2235/6581 (2013.01 - EP US); C04B 2237/123 (2013.01 - EP US); C04B 2237/124 (2013.01 - EP US); C04B 2237/16 (2013.01 - EP US); C04B 2237/363 (2013.01 - EP US); C04B 2237/407 (2013.01 - EP US); C04B 2237/52 (2013.01 - EP US); C04B 2237/708 (2013.01 - EP US)
Citation (search report)
See references of WO 2008116989A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2912675 A1 20080822; FR 2912675 B1 20090417; CN 101626865 A 20100113; CN 101626865 B 20130508; EP 2125281 A1 20091202; JP 2010517789 A 20100527; JP 5295129 B2 20130918; US 2010055478 A1 20100304; US 8757475 B2 20140624; WO 2008116989 A1 20081002
DOCDB simple family (application)
FR 0701156 A 20070216; CN 200880004752 A 20080214; EP 08761889 A 20080214; FR 2008000198 W 20080214; JP 2009549446 A 20080214; US 52729108 A 20080214