EP 2125942 A1 20091202 - COPPER-CONTAINING POLYESTER MOULDING COMPOUND, AND PRODUCTION AND USE THEREOF
Title (en)
COPPER-CONTAINING POLYESTER MOULDING COMPOUND, AND PRODUCTION AND USE THEREOF
Title (de)
KUPFERENTHALTENDE FORMMASSE AUS POLYESTER IHRE HERSTELLUNG UND VERWENDUNG
Title (fr)
MATIÈRE À MOULER CONTENANT DU CUIVRE ET CONSTITUÉE DE POLYESTER, PRODUCTION ET UTILISATION DE LADITE MATIÈRE
Publication
Application
Priority
- EP 2008000179 W 20080111
- DE 102007003648 A 20070118
Abstract (en)
[origin: WO2008086982A1] The invention relates to a moulding compound containing: i) between 0.001 and 10 wt. % - in relation to the total weight of the constituents (i) to (iii) - of copper or a copper alloy predominantly containing copper; ii) between 0.001 and 99.999 wt. % of at least one polyester based on aromatic dicarboxylic acids and an aliphatic or aromatic dihydroxy compound; and/or iii) between 0 and 99.999 wt. % of a polyester consisting of: A) a (cyclo)aliphatic dicarboxylic acid or the ester-forming derivatives thereof and B) a diol constituent consisting of a (cyclo)alkane diol; and iv) between 0 and 300 wt. % - in relation to the weight of the constituents (i) to (iii) - of standard auxilary agents and additives.
IPC 8 full level
C08K 3/08 (2006.01); A01N 59/20 (2006.01)
CPC (source: EP)
A01N 25/10 (2013.01); A01N 25/34 (2013.01); A01N 59/20 (2013.01)
Citation (search report)
See references of WO 2008086982A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102007003648 A1 20080724; EP 2125942 A1 20091202; WO 2008086982 A1 20080724; WO 2008086982 A9 20091210; WO 2008086982 B1 20080925
DOCDB simple family (application)
DE 102007003648 A 20070118; EP 08701084 A 20080111; EP 2008000179 W 20080111