Global Patent Index - EP 2128305 A1

EP 2128305 A1 20091202 - Metallic compound wire with at least two metallic layers

Title (en)

Metallic compound wire with at least two metallic layers

Title (de)

Metallischer Verbunddraht mit wenigstens zwei metallischen Schichten

Title (fr)

Fil en acier composite métallique doté d'au moins deux couches métalliques

Publication

EP 2128305 A1 20091202 (DE)

Application

EP 09450072 A 20090402

Priority

AT 8712008 A 20080529

Abstract (en)

The metallic composite wire comprises an external layer, which consists of copper and an internal layer, which consists of non-iron metal alloy. The surface portion of the copper layer is 65-70% of the total cross-section area of the composite wire, which has round cross section and cross sectional area of 0.05-0.50 mm 2>.

Abstract (de)

Ein metallischer Verbunddraht weist wenigstens zwei metallische Schichten auf. Eine Schicht, vorzugsweise die innere Schicht ist eine Nicht-Eisen-Metall-Legierung und eine zweite Schicht, vorzugsweise die äußerste Schicht, besteht aus Kupfer.

IPC 8 full level

C23C 28/00 (2006.01); B21C 37/04 (2006.01); C23C 30/00 (2006.01)

CPC (source: EP US)

B21C 37/042 (2013.01 - EP US); C23C 28/021 (2013.01 - EP US); C23C 28/023 (2013.01 - EP US); C23C 30/00 (2013.01 - EP US); Y10T 428/1291 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2128305 A1 20091202; AT 506897 A1 20091215; AT 506897 B1 20100315; JP 2009289746 A 20091210; US 2009297883 A1 20091203

DOCDB simple family (application)

EP 09450072 A 20090402; AT 8712008 A 20080529; JP 2009124392 A 20090522; US 47269809 A 20090527