EP 2129808 A2 20091209 - AUSTENITIC IRON-NICKEL-CHROMIUM-COPPER ALLOY
Title (en)
AUSTENITIC IRON-NICKEL-CHROMIUM-COPPER ALLOY
Title (de)
AUSTENITISCHE EISEN-NICKEL-CHROM-KUPFER-LEGIERUNG
Title (fr)
ALLIAGE AUSTENITIQUE FER-NICKEL-CHROME-CUIVRE
Publication
Application
Priority
- FR 2008000403 W 20080326
- EP 07290382 A 20070330
- EP 08787849 A 20080326
Abstract (en)
[origin: EP1975269A1] Austenitic alloy of iron-nickel-chromium-copper composition, comprises: nickel (Ni) (= 36%); chromium (Cr) (>= 0.02%); copper (Cu) (>= 0.1%); mixture of copper and cobalt (Co) (= 15%); manganese (Mn) (0.02-2%); mixture of aluminum (Al) and titanium (Ti) (0-3%); carbon (C) (0-2%); mixture of vanadium (V) and tungsten (W) (0-6%); mixture of niobium (Nb) and zirconium (Zr) (0-0.5%); molybdenum (Mo) (0-8%); tin (Sn) (= 1%); boron (B) (0-0.006%); mixture of sulfur (S), selenium (Se) and antimony (Sb) (= 0.008%); and mixture of calcium (Ca) and magnesium (Mg) (0-0.020%). Austenitic alloy of iron-nickel-chromium-copper composition, comprises: nickel (Ni) (= 36%); chromium (Cr) (>= 0.02%); copper (Cu) (>= 0.1%); mixture of copper and cobalt (Co) (= 15%); manganese (Mn) (0.02-2%); mixture of aluminum (Al) and titanium (Ti) (0-3%); carbon (C) (0-2%); mixture of vanadium (V) and tungsten (W) (0-6%); mixture of niobium (Nb) and zirconium (Zr) (0-0.5%); molybdenum (Mo) (0-8%); tin (Sn) (= 1%); boron (B) (0-0.006%); mixture of sulfur (S), selenium (Se) and antimony (Sb) (= 0.008%); and mixture of calcium (Ca) and magnesium (Mg) (0-0.020%). Where: the rest is iron and the impurities resulting from the elaboration, the percentages in Ni, Cr, Cu and Co alloy satisfying the following conditions: Co is less than Cu; Co is less than 4%, if Cr is greater than 7.5%; Ni+1.2Cr+(Cu/5) (I) is greater than 28%; and Cr is 7.5%, if Ni is greater than 32.5%; and the manganese content satisfying the following conditions if 6Ni-2.5X+4(Cu+Co) (III) (where X is Cr+V+W+silicon (Si)+Al) >= 205, Mn = Ni- 27.5 + Cu- Cr, if 180.5 = (III) = 205, Mn = 4%, and if (III) = 180.5, Mn = 2%. Independent claims are included for: (1) an electromagnetic device with self-regulation of temperature comprising the alloy; (2) a device with self-regulation of magnetic flux comprising the alloy; (3) a device with controlled dilation comprising the alloy; (4) current sensors, measurement transformers or magneto-harmonic sensor comprising the alloy; (5) electromagnetic motors and actuators comprising the alloy; (6) stators for horology engines comprising the alloy; (7) inductors or transformers for power electronics comprising the alloy; (8) bimetals comprising the alloy; (9) coil layer of horology engines or high sensitive electromagnetic relay comprising the alloy; and (10) temperature measurement devices or temperature marking devices, without contact, comprising the alloy; and (11) hypertextured substrates for epitaxy comprising the alloy.
IPC 8 full level
C22C 38/08 (2006.01); C22C 19/00 (2006.01); H01F 10/12 (2006.01)
CPC (source: EP KR US)
C21D 1/74 (2013.01 - EP US); C21D 6/001 (2013.01 - EP US); C21D 6/004 (2013.01 - EP US); C21D 8/1244 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/08 (2013.01 - EP KR US); C22C 38/16 (2013.01 - EP US); C22C 38/42 (2013.01 - EP KR US); C22C 38/58 (2013.01 - EP US); H01F 1/14708 (2013.01 - EP US); H01F 10/12 (2013.01 - KR); C21D 2211/001 (2013.01 - EP US)
Citation (search report)
See references of WO 2008142229A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1975269 A1 20081001; BR PI0809850 A2 20140923; CA 2682233 A1 20081127; CA 2682233 C 20120605; CN 101680070 A 20100324; CN 101680070 B 20110504; EP 2129808 A2 20091209; EP 2129808 B1 20180321; ES 2672020 T3 20180612; JP 2010534277 A 20101104; JP 2015007287 A 20150115; JP 5840361 B2 20160106; KR 101835139 B1 20180413; KR 20100016053 A 20100212; MX 2009010504 A 20100330; RU 2009140089 A 20110510; RU 2456366 C2 20120720; US 2010102910 A1 20100429; WO 2008142229 A2 20081127; WO 2008142229 A3 20090319
DOCDB simple family (application)
EP 07290382 A 20070330; BR PI0809850 A 20080326; CA 2682233 A 20080326; CN 200880016938 A 20080326; EP 08787849 A 20080326; ES 08787849 T 20080326; FR 2008000403 W 20080326; JP 2010500315 A 20080326; JP 2014150931 A 20140724; KR 20097022683 A 20080326; MX 2009010504 A 20080326; RU 2009140089 A 20080326; US 59372608 A 20080326